MM

Moriya Miyashita

KT Kabushiki Kaisha Toshiba: 10 patents #3,082 of 21,451Top 15%
GC Globalwafers Japan Co.: 1 patents #21 of 44Top 50%
TU Tohoku University: 1 patents #615 of 1,680Top 40%
📍 Kitakami, JP: #5 of 52 inventorsTop 10%
Overall (All Time): #440,826 of 4,157,543Top 15%
11
Patents All Time

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
11887845 Method for producing three-dimensional structure, method for producing vertical transistor, vertical transistor wafer, and vertical transistor substrate Kazutaka KAMIJO, Etsuo Fukuda, Takashi Ishikawa, Koji Izunome, Takao Sakamoto +1 more 2024-01-30
7700381 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them Tsunetoshi Arikado, Masao Iwase, Soichi Nadahara, Yuso Udo, Yukihiro Ushiku +8 more 2010-04-20
7057259 Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them Tsunetoshi Arikado, Masao Iwase, Soichi Nadahara, Yuso Udo, Yukihiro Ushiku +8 more 2006-06-06
6222252 Semiconductor substrate and method for producing the same Masanori Numano 2001-04-24
6037270 Method of manufacturing semiconductor device and methods of processing, analyzing and manufacturing its substrate Mokuji Kageyama 2000-03-14
5951755 Manufacturing method of semiconductor substrate and inspection method therefor Masanobu Ogino, Tadahide Hoshi, Masanori Numano, Shuichi Samata, Akiko Sekihara +1 more 1999-09-14
5508800 Semiconductor substrate, method of manufacturing semiconductor substrate and semiconductor device, and method of inspecting and evaluating semiconductor substrate Hachiro Hiratsuka, Atsuko Kubota, Shuichi Samata, Masanori Numano, Hiroyuki Fukui 1996-04-16
5271796 Method and apparatus for detecting defect on semiconductor substrate surface Mokuji Kageyama, Hachiro Hiratsuka 1993-12-21
5071776 Wafer processsing method for manufacturing wafers having contaminant-gettering damage on one surface Yoshiaki Matsushita, Makiko Wakatsuki, Norihiko Tsuchiya, Atsuko Kubota 1991-12-10
4980300 Gettering method for a semiconductor wafer Shintaro Yoshii, Keiko SAKUMA 1990-12-25
4971920 Gettering method for semiconductor wafers Ayako Maeda 1990-11-20