Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12371813 | Silicon wafer and method for producing silicon wafer | Haruo Sudo, Takashi Ishikawa, Koji Izunome, Hisashi Matsumura, Tatsuhiko Aoki +2 more | 2025-07-29 |
| 12148468 | Semiconductor memory device and control device for semiconductor memory device | Hiroshi Yoshida, Toshimasa Namekawa, Satoru Araki, Tetsuo Endoh | 2024-11-19 |
| 11887845 | Method for producing three-dimensional structure, method for producing vertical transistor, vertical transistor wafer, and vertical transistor substrate | Kazutaka KAMIJO, Takashi Ishikawa, Koji Izunome, Moriya Miyashita, Takao Sakamoto +1 more | 2024-01-30 |
| 6853870 | Semiconductor processing process control system and its control method | Shoichi Harakawa, Makoto Ikeda | 2005-02-08 |
| 6745094 | Semiconductor processing process control system and its control method | Shoichi Harakawa, Makoto Ikeda | 2004-06-01 |
| 6546300 | Production/manufacturing planning system | Shinichi Hohkibara | 2003-04-08 |
| 6463350 | Production system for manufacturing semiconductor devices by lot | Hiroshi Nanami, Hidehiro Okutani | 2002-10-08 |
| 6438436 | Production scheduling management system, and method of managing production scheduling | Shinichi Hohkibara, Hiroshi Nanami | 2002-08-20 |
| 6112130 | Semiconductor product manufacturing execution system and semiconductor product manufacturing method | Hidehiro Okutani | 2000-08-29 |
| 5694325 | Semiconductor production system | Masayoshi Tazawa, Kazuyuki Miura, Tomiko Takano, Yuichi Satoguchi, Yuichiro Ozaki | 1997-12-02 |
| 5408858 | Bending machine utilizing controlled expandable pressure device to apply uniform pressure to work material | — | 1995-04-25 |
| 5365766 | Die assembly having means for automatically controlling in the angular orientation of the lower die plate members | Yukio Takahashi | 1994-11-22 |