Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5951755 | Manufacturing method of semiconductor substrate and inspection method therefor | Moriya Miyashita, Masanobu Ogino, Masanori Numano, Shuichi Samata, Akiko Sekihara +1 more | 1999-09-14 |
| 5352625 | Method of manufacturing semiconductor substrate | — | 1994-10-04 |
| 5273553 | Apparatus for bonding semiconductor substrates | Kiyoshi Yoshikawa | 1993-12-28 |
| 5196375 | Method for manufacturing bonded semiconductor body | — | 1993-03-23 |
| 5129827 | Method for bonding semiconductor substrates | Kiyoshi Yoshikawa | 1992-07-14 |
| 5068704 | Method of manufacturing semiconductor device | Akio Nakagawa, Kaoru Imamura, Ryo Sato | 1991-11-26 |
| 4935386 | Method of manufacturing semiconductor device including substrate bonding and outdiffusion by thermal heating | Akio Nakagawa, Kaoru Imamura, Ryo Sato | 1990-06-19 |