AS

Atsushi Shigeta

KT Kabushiki Kaisha Toshiba: 41 patents #486 of 21,451Top 3%
EB Ebara: 18 patents #107 of 1,611Top 7%
JS Jsr: 2 patents #443 of 1,137Top 40%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
Toshiba Memory: 1 patents #1,210 of 1,971Top 65%
Overall (All Time): #68,103 of 4,157,543Top 2%
44
Patents All Time

Issued Patents All Time

Showing 26–44 of 44 patents

Patent #TitleCo-InventorsDate
7014529 Substrate processing method and substrate processing apparatus Takeo Kubota, Gen Toyota 2006-03-21
7005382 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing Kazuo Nishimoto, Tatsuaki Sakano, Akihiro Takemura, Masayuki Hattori, Nobuo Kawahashi +3 more 2006-02-28
6997782 Polishing apparatus and a method of polishing and cleaning and drying a wafer Toyomi Nishi, Tetsuji Togawa, Harumitsu Saito, Manabu Tsujimura, Hiromi Yajima +7 more 2006-02-14
6984532 Method of judging residual film by optical measurement Takeo Kubota 2006-01-10
6743645 Method of inspecting process for manufacturing semiconductor device and method of manufacturing semiconductor device Takeo Kubota 2004-06-01
6500051 Polishing apparatus and method Toyomi Nishi, Tetsuji Togawa, Harumitsu Saito, Manabu Tsujimura, Hiromi Yajima +7 more 2002-12-31
5948205 Polishing apparatus and method for planarizing layer on a semiconductor wafer Masako Kodera, Hiroyuki Yano, Riichirou Aoki, Hiromi Yajima, Haruo Okano 1999-09-07
5914275 Polishing apparatus and method for planarizing layer on a semiconductor wafer Masako Kodera, Hiroyuki Yano, Riichirou Aoki, Hiromi Yajima, Haruo Okano 1999-06-22
5860181 Method of and apparatus for cleaning workpiece Toshiro Maekawa, Satomi Hamada, Koji Ono, Masako Kodera 1999-01-19
5846335 Method for cleaning workpiece Toshiro Maekawa, Koji Ono, Motoaki Okada, Tamami Takahashi, Shiro Mishima +3 more 1998-12-08
5830041 Method and apparatus for determining endpoint during a polishing process Tamami Takahashi, Fumihiko Sakata, Norio Kimura, Masako Kodera 1998-11-03
5695601 Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method Masako Kodera, Shiro Mishima, Hiromi Yajima, Riichirou Aoki 1997-12-09
5679059 Polishing aparatus and method Toyomi Nishi, Tetsuji Togawa, Harumitsu Saito, Manabu Tsujimura, Hiromi Yajima +7 more 1997-10-21
5653623 Polishing apparatus with improved exhaust Norio Kimura, Seiji Ishikawa, Masako Kodera, Riichirou Aoki 1997-08-05
5616063 Polishing apparatus Katsuya Okumura, Riichirou Aoki, Hiromi Yajima, Masako Kodera, Shirou Mishima +3 more 1997-04-01
5597341 Semiconductor planarizing apparatus Masako Kodera, Hiroyuki Yano, Riichirou Aoki, Hiromi Yajima, Haruo Okano 1997-01-28
5578531 Method for manufacturing semiconductor device Masako Kodera, Hiroyuki Yano 1996-11-26
5445996 Method for planarizing a semiconductor device having a amorphous layer Masako Kodera, Hiroyuki Yano, Riichirou Aoki, Hiromi Yajima, Haruo Okano 1995-08-29
5398459 Method and apparatus for polishing a workpiece Katsuya Okumura, Tohru Watanabe, Riichirou Aoki, Hiroyuki Yano, Masako Kodera +4 more 1995-03-21