RA

Riichirou Aoki

KT Kabushiki Kaisha Toshiba: 20 patents #1,460 of 21,451Top 7%
EB Ebara: 10 patents #224 of 1,611Top 15%
Overall (All Time): #211,684 of 4,157,543Top 6%
21
Patents All Time

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDate
6966821 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Katsuya Okumura, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura 2005-11-22
6547638 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Katsuya Okumura, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura 2003-04-15
6443808 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Katsuya Okumura, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura 2002-09-03
6439971 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Katsuya Okumura, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura 2002-08-27
6425806 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Katsuya Okumura, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura 2002-07-30
6273802 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Katsuya Okumura, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura 2001-08-14
5948205 Polishing apparatus and method for planarizing layer on a semiconductor wafer Masako Kodera, Hiroyuki Yano, Atsushi Shigeta, Hiromi Yajima, Haruo Okano 1999-09-07
5914275 Polishing apparatus and method for planarizing layer on a semiconductor wafer Masako Kodera, Hiroyuki Yano, Atsushi Shigeta, Hiromi Yajima, Haruo Okano 1999-06-22
5885138 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device Katsuya Okumura, Hiromi Yajima, Seiji Ishikawa, Manabu Tsujimura 1999-03-23
5695601 Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method Masako Kodera, Atsushi Shigeta, Shiro Mishima, Hiromi Yajima 1997-12-09
5653623 Polishing apparatus with improved exhaust Norio Kimura, Seiji Ishikawa, Masako Kodera, Atsushi Shigeta 1997-08-05
5641581 Semiconductor device Yukio Nishiyama, Rempei Nakata, Nobuo Hayasaka, Haruo Okano, Takahito Nagamatsu +3 more 1997-06-24
5616063 Polishing apparatus Katsuya Okumura, Hiromi Yajima, Masako Kodera, Shirou Mishima, Atsushi Shigeta +3 more 1997-04-01
5597341 Semiconductor planarizing apparatus Masako Kodera, Hiroyuki Yano, Atsushi Shigeta, Hiromi Yajima, Haruo Okano 1997-01-28
5571578 Method for forming silicon oxide on a semiconductor Naruhiko Kaji, Hiroyuki Toyama, Hidemitsu Egawa, Takamitsu Yoshida, Yukio Nishiyama 1996-11-05
5445996 Method for planarizing a semiconductor device having a amorphous layer Masako Kodera, Hiroyuki Yano, Atsushi Shigeta, Hiromi Yajima, Haruo Okano 1995-08-29
5429995 Method of manufacturing silicon oxide film containing fluorine Yukio Nishiyama, Rempei Nakata, Nobuo Hayasaka, Haruo Okano, Takahito Nagamatsu +3 more 1995-07-04
5398459 Method and apparatus for polishing a workpiece Katsuya Okumura, Tohru Watanabe, Hiroyuki Yano, Masako Kodera, Atsushi Shigeta +4 more 1995-03-21
5068709 Semiconductor device having a backplate electrode Hidemitsu Egawa, Katsuya Okumura 1991-11-26
4937652 Semiconductor device and method of manufacturing the same Katsuya Okumura, Toshinori Shinki, Toshiaki Idaka 1990-06-26
4875088 Semiconductor device having a backplate electrode Hidemitsu Egawa, Katsuya Okumura 1989-10-17