Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12419062 | Method for manufacturing semiconductor device including capacitor structure having lower electrode with different lengths | — | 2025-09-16 |
| 11829546 | Border touch module | Ching-Kai Cho, Zhi Juan Lin, Ting-Chieh Chien, Hua Li Luo | 2023-11-28 |
| 11586314 | Border touch module | Ching-Kai Cho, Zhi Juan Lin, Ting-Chieh Chien, Hua Li Luo | 2023-02-21 |
| 10777433 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Spyridon Skordas, Robert R. Young | 2020-09-15 |
| 10615139 | Semiconductor device including built-in crack-arresting film structure | Leathen Shi, Spyridon Skordas, Kevin R. Winstel | 2020-04-07 |
| 10332837 | Enhancing barrier in air gap technology | Takeshi Nogami | 2019-06-25 |
| 10276500 | Enhancing barrier in air gap technology | Takeshi Nogami | 2019-04-30 |
| 10269760 | Advanced chip to wafer stacking | Spyridon Skordas | 2019-04-23 |
| 10211178 | Semiconductor device including built-in crack-arresting film structure | Leathen Shi, Spyridon Skordas, Kevin R. Winstel | 2019-02-19 |
| 10170447 | Advanced chip to wafer stacking | Spyridon Skordas | 2019-01-01 |
| 10157757 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Spyridon Skordas, Robert R. Young | 2018-12-18 |
| 10056272 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Spyridon Skordas, Robert R. Young | 2018-08-21 |
| 10047264 | Polymer composite thermal interface material with high thermal conductivity | — | 2018-08-14 |
| 10020279 | Semiconductor device including built-in crack-arresting film structure | Leathen Shi, Spyridon Skordas, Kevin R. Winstel | 2018-07-10 |
| 9922851 | Gas-controlled bonding platform for edge defect reduction during wafer bonding | Spyridon Skordas, Robert R. Young | 2018-03-20 |
| 9881896 | Advanced chip to wafer stacking | Spyridon Skordas | 2018-01-30 |
| 9847295 | Enhancing barrier in air gap technology | Takeshi Nogami | 2017-12-19 |
| 9806032 | Integrated circuit structure with refractory metal alignment marker and methods of forming same | Nailong HE, Upinder Singh | 2017-10-31 |
| 9640514 | Wafer bonding using boron and nitrogen based bonding stack | Troy L. Graves-Abe, Donald F. Canaperi, Spyridon Skordas, Matthew T. Shoudy, Binglin Miao +2 more | 2017-05-02 |
| 9620481 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more | 2017-04-11 |
| 9564386 | Semiconductor package with structures for cooling fluid retention | Son V. Nguyen, Spyridon Skordas, Tuan A. Vo | 2017-02-07 |
| 9553054 | Strain detection structures for bonded wafers and chips | Mukta G. Farooq, John A. Fitzsimmons, Erdem Kaltalioglu, Spyridon Skordas, Kevin R. Winstel | 2017-01-24 |
| 9536853 | Semiconductor device including built-in crack-arresting film structure | Leathen Shi, Spyridon Skordas, Kevin R. Winstel | 2017-01-03 |
| 9472457 | Manganese oxide hard mask for etching dielectric materials | Spyridon Skordas, Tuan A. Vo | 2016-10-18 |
| 9466538 | Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process | Spyridon Skordas, Subramanian S. Iyer, Donald F. Canaperi, Shidong Li | 2016-10-11 |