Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2002-03-19 |
| 6124041 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2000-09-26 |
| 5925443 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 1999-07-20 |
| 5541005 | Large ceramic article and method of manufacturing | Raschid J. Bezama, Jon A. Casey, Mario E. Ecker, Shaji Farooq, Irene S. Frantz +12 more | 1996-07-30 |
| 5532031 | I/O pad adhesion layer for a ceramic substrate | Shaji Farooq, Sampath Purushothaman, Srinivasa S. N. Reddy | 1996-07-02 |
| 5483105 | Module input-output pad having stepped set-back | Suryanarayana Kaja, Eric D. Perfecto, William H. Price, Sampath Purushothaman, Srinivasa N. Reddy +1 more | 1996-01-09 |
| 5439636 | Large ceramic articles and method of manufacturing | Raschid J. Bezama, Jon A. Casey, Mario E. Ecker, Shaji Farooq, Irene S. Frantz +12 more | 1995-08-08 |
| 5304517 | Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering | Jon A. Casey, Sylvia Marie DeCarr, Srinivasa S. N. Reddy, Subhash L. Shinde, Rao R. Tummala | 1994-04-19 |