Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205793 | Method and apparatus for anisotropic pattern etching and treatment | Shuogang Huang, Zhimin Wan, Mark Merrill | 2025-01-21 |
| 9236279 | Method of dielectric film treatment | Ji Zhu, John deLarios, Mark Wilcoxson | 2016-01-12 |
| 8828145 | Method of particle contaminant removal | Yizhak Sabba, Mark Kawaguchi, Mark Wilcoxson, Dragan Podlesnik | 2014-09-09 |
| 8617993 | Method of reducing pattern collapse in high aspect ratio nanostructures | Amir A. Yasseri, Ji Zhu, David Mui, Katrina Mikhaylichenko | 2013-12-31 |
| 8277675 | Method of damaged low-k dielectric film layer removal | Seong Hwan Cho, Shrikant Lohokare, Mark Wilcoxson, John M. de Larios, Stephan Hoffmann | 2012-10-02 |
| 8277570 | Method of preventing premature drying | Mark Wilcosson | 2012-10-02 |
| 8021512 | Method of preventing premature drying | Mark Wilcoxson | 2011-09-20 |
| 7967916 | Method of preventing pattern collapse during rinsing and drying | John deLarios | 2011-06-28 |
| 7810513 | Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same | John M. Boyd, Fritz Redeker | 2010-10-12 |
| 7597765 | Post etch wafer surface cleaning with liquid meniscus | Ji Zhu, Mark Wilcoxson, John M. de Larios | 2009-10-06 |
| 7584761 | Wafer edge surface treatment with liquid meniscus | John M. Boyd, John M. de Larios, Fritz Redeker | 2009-09-08 |
| 7568488 | Enhanced wafer cleaning method | John M. Boyd, Mark Wilcoxson, John deLarios | 2009-08-04 |
| 7329321 | Enhanced wafer cleaning method | John M. Boyd, Mark Wilcoxson, John deLarios | 2008-02-12 |
| 7294580 | Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition | Ji Zhu, Peter Cirigliano, Sangheon Lee, Thomas S. Choi, Peter Loewenhardt +4 more | 2007-11-13 |