| 12136655 |
Backside electrical contacts to buried power rails |
Ruilong Xie, Brent A. Anderson, Albert M. Young, Kangguo Cheng, Julien Frougier +2 more |
2024-11-05 |
| 12106969 |
Substrate thinning for a backside power distribution network |
Ruilong Xie, Balasubramanian Pranatharthiharan, Mukta G. Farooq, Julien Frougier, Takeshi Nogami +1 more |
2024-10-01 |
| 12002758 |
Backside metal-insulator-metal (MIM) capacitors extending through backside interlayer dielectric (BILD) layer or semiconductor layer and partly through dielectric layer |
Ruilong Xie, Takeshi Nogami, Balasubramanian Pranatharthiharan, Chih-Chao Yang |
2024-06-04 |
| 11915966 |
Backside power rail integration |
Ruilong Xie, Takeshi Nogami, Balasubramanian Pranatharthiharan, Albert M. Young, Kisik Choi +1 more |
2024-02-27 |
| 9171742 |
Alignment of integrated circuit chip stack |
Evan G. Colgan, Steven A. Cordes, Daniel C. Edelstein, Vijayeshwar D. Khanna, Kenneth F. Latzko +4 more |
2015-10-27 |
| 8962448 |
Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier |
Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more |
2015-02-24 |
| 8738167 |
3D integrated circuit device fabrication with precisely controllable substrate removal |
Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman |
2014-05-27 |
| 8664081 |
Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier |
Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more |
2014-03-04 |
| 8629553 |
3D integrated circuit device fabrication with precisely controllable substrate removal |
Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman |
2014-01-14 |
| 8546188 |
Bow-balanced 3D chip stacking |
Fei Liu, Albert M. Young |
2013-10-01 |
| 8492869 |
3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer |
Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more |
2013-07-23 |
| 8399336 |
Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer |
Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more |
2013-03-19 |
| 8298914 |
3D integrated circuit device fabrication using interface wafer as permanent carrier |
Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more |
2012-10-30 |
| 8129256 |
3D integrated circuit device fabrication with precisely controllable substrate removal |
Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Sampath Purushothaman |
2012-03-06 |
| 6339527 |
Thin film capacitor on ceramic |
Mukta S. Farooq, John U. Knickerbocker, Srinivasa S. N. Reddy, Robert A. Rita |
2002-01-15 |
