PW

Paul R. Walling

IBM: 16 patents #6,952 of 70,183Top 10%
Overall (All Time): #293,845 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10956649 Semiconductor package metal shadowing checks Anson J. Call, Francesco Preda 2021-03-23
10949600 Semiconductor package floating metal checks Jean Audet, Franklin M. Baez, Jason L. Frankel 2021-03-16
10706204 Automated generation of surface-mount package design Jean Audet, Alain Ayotte, Franklin M. Baez, Anson J. Call, Deana Cosmadelis +5 more 2020-07-07
10546096 Semiconductor package via stack checking Anson J. Call 2020-01-28
10423752 Semiconductor package metal shadowing checks Anson J. Call, Francesco Preda 2019-09-24
10423751 Semiconductor package floating metal checks Jean Audet, Franklin M. Baez, Jason L. Frankel 2019-09-24
10375820 Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Roger D. Weekly 2019-08-06
9955567 Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Roger D. Weekly 2018-04-24
8927879 Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Roger D. Weekly 2015-01-06
8756546 Elastic modulus mapping of a chip carrier in a flip chip package Erwin B. Cohen, Mark C. H. Lamorey, Marek A. Orlowski, Douglas O. Powell, David L. Questad +1 more 2014-06-17
7325213 Nested design approach Harsaran S. Bhatia, Marie Cole, Michael S. Cranmer, Jason L. Frankel, Eric V. Kline +1 more 2008-01-29
7096451 Mesh plane generation and file storage Alice L. Donaldson, Jason L. Frankel, John A. Ludwig, Kenneth A. Papae, Rafael Perez-Acevedo +1 more 2006-08-22
6528735 Substrate design of a chip using a generic substrate design Harsaran S. Bhatia, Raymond Morris Bryant, Suresh D. Kadakia, David C. Long 2003-03-04
6261467 Direct deposit thin film single/multi chip module Ajay P. Giri, Sundar M. Kamath, Daniel O'Connor, Rajesh B. Patel, Herbert I. Stoller +1 more 2001-07-17
6037044 Direct deposit thin film single/multi chip module Ajay P. Giri, Sundar M. Kamath, Daniel O'Connor, Rajesh B. Patel, Herbert I. Stoller +1 more 2000-03-14
5677847 Method and apparatus for designing a module 1997-10-14