Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183688 | Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE | Valery Ouvarov-Bancalero, John Harper, Malavarayan Sankarasubramanian, Bamidele Daniel Falola, Ravi Siddappa +1 more | 2024-12-31 |
| 10651108 | Foam composite | Zhizhong Tang, Syadwad Jain, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu +3 more | 2020-05-12 |
| 10535615 | Electronic package that includes multi-layer stiffener | Manish Dubey, Srikant Nekkanty, Rajendra C. Dias | 2020-01-14 |
| 10290569 | Constrained cure component attach process for improved IC package warpage control | Kyle Yazzie, Venkata Suresh R. Guthikonda, Santosh Sankarasubramanian, Kevin Y. Lin, Leigh M. TRIBOLET +2 more | 2019-05-14 |
| 9887104 | Electronic package and method of connecting a first die to a second die to form an electronic package | Manish Dubey, Rajendra C. Dias, David Woodhams | 2018-02-06 |
| 9832860 | Panel level fabrication of package substrates with integrated stiffeners | Robert Starkston, John S. Guzek, Keith Jones, Javier Soto Gonzalez | 2017-11-28 |
| 9418912 | Methods of forming serpentine thermal interface material and structures formed thereby | Kelly Lofgreen | 2016-08-16 |
| 9230877 | Methods of forming serpentine thermal interface material and structures formed thereby | Kelly Lofgreen | 2016-01-05 |