Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10081852 | Solder preform and a process for its manufacture | Akira Tanahashi, Yoshitsugu Sakamoto, Kaichi Tsuruta, Takashi Ishii, Satoshi Soga | 2018-09-25 |
| 10002841 | Semiconductor device | Shotaro Miyawaki, Akiyoshi Asai, Yasutomi Asai | 2018-06-19 |
| 9269576 | Silicon carbide semiconductor substrate and method for manufacturing same | Shouichi Yamauchi | 2016-02-23 |
| 7800230 | Solder preform and electronic component | Yoshitsugu Sakamoto, Tomomi Okumura, Kaichi Tsuruta, Minoru Ueshima, Takashi Ishii | 2010-09-21 |
| 7793820 | Solder preform and a process for its manufacture | Akira Tanahashi, Yoshitsugu Sakamoto, Kaichi Tsuruta, Takashi Ishii, Satoshi Soga | 2010-09-14 |
| 7468318 | Method for manufacturing mold type semiconductor device | Nobuyuki Kato, Takanori Teshima, Yoshitsugu Sakamoto, Shoji Miura, Akihiro Niimi | 2008-12-23 |
| 7345369 | Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same | Naoki Hirasawa, Sadahisa Onimaru, Hirohito Matsui, Kuniaki Mamitsu | 2008-03-18 |
| 7239016 | Semiconductor device having heat radiation plate and bonding member | Nobuyuki Kato, Kuniaki Mamitsu, Yoshimi Nakase | 2007-07-03 |
| 7235876 | Semiconductor device having metallic plate with groove | Tomomi Okumura, Yoshitsugu Sakamoto, Kuniaki Mamitsu | 2007-06-26 |
| 7193326 | Mold type semiconductor device | Nobuyuki Kato, Takanori Teshima, Yoshitsugu Sakamoto, Shoji Miura, Akihiro Niimi | 2007-03-20 |
| 7145254 | Transfer-molded power device and method for manufacturing transfer-molded power device | Takanori Teshima, Yoshimi Nakase, Kenji Yagi, Yasushi Ookura, Kuniaki Mamitsu +2 more | 2006-12-05 |
| 7019395 | Double-sided cooling type semiconductor module | Takanori Teshima | 2006-03-28 |
| 6927167 | Method for manufacturing semiconductor device having controlled surface roughness | Yutaka Fukuda, Chikage Noritake, Shoji Miura | 2005-08-09 |
| 6917103 | Molded semiconductor power device having heat sinks exposed on one surface | Takanori Teshima, Yoshimi Nakase, Shoji Miura | 2005-07-12 |
| 6884953 | Switching circuit | Yoshibide Nii | 2005-04-26 |
| 6803667 | Semiconductor device having a protective film | Yasushi Okura, Kuniaki Mamitsu | 2004-10-12 |
| 6384431 | Insulated gate bipolar transistor | Shigeki Takahashi, Takanori Teshima, Norihito Tokura | 2002-05-07 |
| 6111317 | Flip-chip connection type semiconductor integrated circuit device | Takashi Okada, Hiroshi Tazawa, Eiichi Hosomi, Chiaki Takubo, Kazuhide Doi +2 more | 2000-08-29 |
| 5814891 | Flip-chip connecting type semiconductor device | — | 1998-09-29 |
| 5801447 | Flip chip mounting type semiconductor device | Kazuhide Doi, Chiaki Takubo, Hiroshi Tazawa, Eiichi Hosomi, Yoichi Hiruta +2 more | 1998-09-01 |
| 5648686 | Connecting electrode portion in semiconductor device | Kazuhide Doi, Masayuki Miura, Takashi Okada, Yoichi Hiruta | 1997-07-15 |
| 5645123 | Semiconductor device having temperature regulation means formed in circuit board | Kazuhide Doi | 1997-07-08 |
| 5633479 | Multilayer wiring structure for attaining high-speed signal propagation | — | 1997-05-27 |
| 5629566 | Flip-chip semiconductor devices having two encapsulants | Kazuhide Doi, Masayuki Miura, Takashi Okada, Yoichi Hiruta | 1997-05-13 |
| 5567983 | Semiconductor apparatus capable of cooling a semiconductor element with radiation efficiency | Yasuhiro Yamaji | 1996-10-22 |