Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062833 | Packaged electronic device having integrated antenna and locking structure | Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2024-08-13 |
| 11677135 | Packaged electronic device having integrated antenna and locking structure | Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2023-06-13 |
| 11658099 | Flip chip curved sidewall self-alignment features for substrate and method for manufacturing the self-alignment features | — | 2023-05-23 |
| 10923800 | Packaged electronic device having integrated antenna and locking structure | — | 2021-02-16 |
| 10861776 | Flip chip self-alignment features for substrate and leadframe applications | — | 2020-12-08 |
| 10861798 | Embedded vibration management system having an array of vibration absorbing structures | Bora Baloglu, Adrian Arcedera, Russell Shumway | 2020-12-08 |
| 10566680 | Packaged electronic device having integrated antenna and locking structure | — | 2020-02-18 |
| 10490487 | Semiconductor package having inspection structure and related methods | — | 2019-11-26 |
| 10211128 | Semiconductor package having inspection structure and related methods | — | 2019-02-19 |
| 10032699 | Flip chip self-alignment features for substrate and leadframe applications | — | 2018-07-24 |
| 10032726 | Embedded vibration management system | Bora Baloglu, Adrian Arcedera, Russell Shumway | 2018-07-24 |
| 9966652 | Packaged electronic device having integrated antenna and locking structure | Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2018-05-08 |
| 9917039 | Method of forming a semiconductor package with conductive interconnect frame and structure | Thinh Pham | 2018-03-13 |
| 9870985 | Semiconductor package with clip alignment notch | — | 2018-01-16 |
| 9362209 | Shielding technique for semiconductor package including metal lid | — | 2016-06-07 |
| 9153543 | Shielding technique for semiconductor package including metal lid and metalized contact area | Anthony E. Panczak | 2015-10-06 |
| 8633575 | IC package with integrated electrostatic discharge protection | — | 2014-01-21 |
| 8415203 | Method of forming a semiconductor package including two devices | Kenneth R. Burch, William H. Lytle | 2013-04-09 |
| 8097494 | Method of making an integrated circuit package with shielding via ring structure | Jinbang Tang, Darrel R. Frear, Jong-Kai Lin, Robert E. Booth, Lawrence N. Herr +1 more | 2012-01-17 |
| 8072062 | Circuit device with at least partial packaging and method for forming | George R. Leal, Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer +1 more | 2011-12-06 |
| 8059380 | Package level ESD protection and method therefor | Sergio A. Ajuria, Melanie Etherton | 2011-11-15 |
| 8044494 | Stackable molded packages and methods of making the same | Addi B. Mistry, David Patten, Jesse Phou, Ziep Tran | 2011-10-25 |
| 7892882 | Methods and apparatus for a semiconductor device package with improved thermal performance | George R. Leal, Victor A. Chiriac, Tien-Yu Lee, Robert J. Wenzel | 2011-02-22 |
| 7807511 | Method of packaging a device having a multi-contact elastomer connector contact area and device thereof | Kenneth R. Burch | 2010-10-05 |
| 7808258 | Test interposer having active circuit component and method therefor | Kenneth R. Burch, David Patten | 2010-10-05 |