Issued Patents All Time
Showing 25 most recent of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11149351 | Apparatus and method for chemical vapor deposition process for semiconductor substrates | Matthias Kuenle, Johannes Baumgartl, Christian Illemann, Francisco Javier Santos Rodriguez, Olaf Storbeck | 2021-10-19 |
| 10672716 | Integrated circuit substrate and method for manufacturing the same | Michael Roesner, Gudrun Stranzl, Martin Zgaga | 2020-06-02 |
| 10622218 | Segmented edge protection shield | Michael Roesner, Georg Ehrentraut | 2020-04-14 |
| 10490425 | Plasma systems and methods of processing using thereof | — | 2019-11-26 |
| 10236204 | Semiconductor processing system | — | 2019-03-19 |
| 10157765 | Methods for processing a semiconductor workpiece | Gudrun Stranzl, Martin Zgaga, Rainer Leuschner, Bernhard Goller, Bernhard Boche +5 more | 2018-12-18 |
| 10074566 | Semiconductor device and methods for forming a plurality of semiconductor devices | Johannes Baumgartl, Oliver Hellmund, Iris Moder, Ingo Muri | 2018-09-11 |
| 10043683 | Plasma system, chuck and method of making a semiconductor device | — | 2018-08-07 |
| 10043640 | Process tools and methods of forming devices using process tools | — | 2018-08-07 |
| 10032670 | Plasma dicing of silicon carbide | Michael Roesner, Gudrun Stranzl | 2018-07-24 |
| 10020285 | Method of producing a semiconductor device and a semiconductor device | Edward Fuergut, Hannes Eder, Bernd Roemer | 2018-07-10 |
| 10020264 | Integrated circuit substrate and method for manufacturing the same | Michael Roesner, Gudrun Stranzl, Martin Zgaga | 2018-07-10 |
| 9875926 | Substrates with buried isolation layers and methods of formation thereof | Iris Moder, Ingo Muri, Johannes Baumgartl, Oliver Hellmund, Hans-Joachim Schulze | 2018-01-23 |
| 9793129 | Segmented edge protection shield | Michael Roesner, Georg Ehrentraut | 2017-10-17 |
| 9679773 | Method for thermal annealing and a semiconductor device formed by the method | — | 2017-06-13 |
| 9666452 | Chip packages and methods for manufacturing a chip package | Karl Mayer, Guenter Tutsch, Horst Theuss, Joachim Mahler | 2017-05-30 |
| 9627287 | Thinning in package using separation structure as stop | Edward Fuergut, Hannes Eder | 2017-04-18 |
| 9613848 | Dielectric structures with negative taper and methods of formation thereof | — | 2017-04-04 |
| 9608201 | Semiconductor devices having insulating substrates and methods of formation thereof | Carsten von Koblinski, Volker Strutz | 2017-03-28 |
| 9530618 | Plasma system, chuck and method of making a semiconductor device | — | 2016-12-27 |
| 9490103 | Separation of chips on a substrate | Gudrun Stranzl, Markus Zundel, Hubert Maier | 2016-11-08 |
| 9481563 | Semiconductor device having a micro-mechanical structure | Martin Zgaga | 2016-11-01 |
| 9455192 | Kerf preparation for backside metallization | Michael Roesner, Johann Schmid, Gudrun Stranzl, Joachim Hirschler | 2016-09-27 |
| 9406564 | Singulation through a masking structure surrounding expitaxial regions | Johannes Baumgartl, Manfred Kotek, Hans-Joachim Schulze | 2016-08-02 |
| 9391263 | Semiconductor devices having insulating substrates and methods of formation thereof | Carsten von Koblinski, Volker Strutz | 2016-07-12 |