| 11840103 |
Tapeless carrier for mechanically fixing tube-shaped objects |
— |
2023-12-12 |
| 9367712 |
High density memory card using folded flex |
Jeffrey Alan Miks, Curtis Zwenger, Barry M. Miles |
2016-06-14 |
| 8129824 |
Shielding for a semiconductor package |
Roger D. St. Amand, Nozad Karim, Joseph Marco Longo, Robert Francis Darveaux, Jong Ok Chun +1 more |
2012-03-06 |
| 8089141 |
Semiconductor package having leadframe with exposed anchor pads |
— |
2012-01-03 |
| 8017436 |
Thin substrate fabrication method and structure |
Ronald Patrick Huemoeller, Sukianto Rusli, Bob Shih-Wei Kuo, Jon Aday, Robert Francis Darveaux |
2011-09-13 |
| 7842541 |
Ultra thin package and fabrication method |
Sukianto Rusli, Ronald Patrick Huemoeller, Bob Shih-Wei Kuo |
2010-11-30 |
| 7687893 |
Semiconductor package having leadframe with exposed anchor pads |
— |
2010-03-30 |
| 7268426 |
High-frequency chip packages |
Michael Warner, Belgacem Haba, Glenn Urbish, Masud Beroz, Teck-Gyu Kang |
2007-09-11 |
| 7176506 |
High frequency chip packages with connecting elements |
Masud Beroz, Michael Warner, Glenn Urbish, Teck-Gyu Kang, Jae M. Park +1 more |
2007-02-13 |
| D483628 |
Food dicing device |
— |
2003-12-16 |
| 6650019 |
Method of making a semiconductor package including stacked semiconductor dies |
Thomas P. Glenn, David Zoba, Kambhampati Ramakrishna, Vincent DiCaprio |
2003-11-18 |
| 6472758 |
Semiconductor package including stacked semiconductor dies and bond wires |
Thomas P. Glenn, David Zoba, Kambhampati Ramakrishna, Vincent DiCaprio |
2002-10-29 |
| D426641 |
Body shaping device |
— |
2000-06-13 |
| 5216922 |
Slope monitoring device |
Eric Gustafson, Jonathan P. Olson, Lyle V. Johnson |
1993-06-08 |