Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9007778 | Signal wiring of touch panel | Hsing-Ming Chang, Zhi-Wei Feng | 2015-04-14 |
| 8780067 | Bridging structure for signal transmission of touch panel | Hsing-Ming Chang | 2014-07-15 |
| 8520380 | Frame of touch panel | — | 2013-08-27 |
| 8486284 | Method for forming a touch sensing pattern and signal wires | Chih-Cheng Chang, Chih-Yung Liu, Chen Yang | 2013-07-16 |
| 8169417 | Signal transfer assembly of touch panel | — | 2012-05-01 |
| 8125460 | Method for manufacturing touch panel with glass panel layer and glass substrate | — | 2012-02-28 |
| 8119937 | Capacitive touch panel | — | 2012-02-21 |
| 7992292 | Method for manufacturing a touch panel | — | 2011-08-09 |
| 7132363 | Stabilizing fluorine etching of low-k materials | Darrell M. Erb, Fei Wang | 2006-11-07 |
| 6924220 | Self-aligned gate formation using polysilicon polish with peripheral protective layer | John Jianshi Wang, Unsoon Kim | 2005-08-02 |
| 6734559 | Self-aligned semiconductor interconnect barrier and manufacturing method therefor | Takeshi Nogami, Dirk Brown, Shekhar Pramanick | 2004-05-11 |
| 6699785 | Conductor abrasiveless chemical-mechanical polishing in integrated circuit interconnects | Kashmir Sahota, Steven C. Avanzino | 2004-03-02 |
| 6605843 | Fully depleted SOI device with tungsten damascene contacts and method of forming same | Zoran Krivokapic, Allison Holbrook, Sunny Cherian | 2003-08-12 |
| 6596637 | Chemically preventing Cu dendrite formation and growth by immersion | Diana M. Schonauer, Steven C. Avanzino | 2003-07-22 |
| 6468894 | Metal interconnection structure with dummy vias | Suzette K. Pangrle | 2002-10-22 |
| 6410442 | Mask-less differential etching and planarization of copper films | — | 2002-06-25 |
| 6410418 | Recess metallization via selective insulator formation on nucleation/seed layer | — | 2002-06-25 |
| 6350678 | Chemical-mechanical polishing of semiconductors | Shekhar Pramanick | 2002-02-26 |
| 6350687 | Method of fabricating improved copper metallization including forming and removing passivation layer before forming capping film | Steven C. Avanzino, Sergey Lopatin, Todd P. Lukanc | 2002-02-26 |
| 6332989 | Slurry for chemical mechanical polishing of copper | Steven C. Avanzino, Christy Mei-Chu Woo | 2001-12-25 |
| 6319833 | Chemically preventing copper dendrite formation and growth by spraying | Diana M. Schonauer, Steven C. Avanzino | 2001-11-20 |
| 6259115 | Dummy patterning for semiconductor manufacturing processes | Lu You, Simon S. Chan | 2001-07-10 |
| 6218290 | Copper dendrite prevention by chemical removal of dielectric | Diana M. Schonauer, Steven C. Avanzino | 2001-04-17 |
| 6207569 | Prevention of Cu dendrite formation and growth | Diana M. Schonauer, Steven C. Avanzino | 2001-03-27 |
| 6197690 | Chemically preventing Cu dendrite formation and growth by double sided scrubbing | Diana M. Schonauer, Steven C. Avanzino | 2001-03-06 |