Issued Patents All Time
Showing 201–219 of 219 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8907427 | Semiconductor device including low-K dielectric cap layer for gate electrodes and related methods | — | 2014-12-09 |
| 8900990 | System and method of combining damascenes and subtract metal etch for advanced back end of line interconnections | Lawrence A. Clevenger, Carl Radens, Yiheng Xu, Walter Kleemeier, Cindy Goldberg | 2014-12-02 |
| 8889506 | Structure and method for interconnect spatial frequency doubling using selective ridges | Lawrence A. Clevenger, Carl Radens, Yiheng Xu, Edem Wornyo | 2014-11-18 |
| 8859350 | Recessed gate field effect transistor | Yiheng Xu, Carl Radens, Lawrence A. Clevenger | 2014-10-14 |
| 8829670 | Through silicon via structure for internal chip cooling | Lawrence A. Clevenger, Carl Radens, Yiheng Xu, Edem Wornyo | 2014-09-09 |
| 8822994 | Method of repairing probe pads | Laertis Economikos, Robin Van Den Nieuwenhuizen, Wei-Tsu Tseng | 2014-09-02 |
| 8685850 | System and method of plating conductive gate contacts on metal gates for self-aligned contact interconnections | Lawrence A. Clevenger, Carl Radens, Yiheng Xu | 2014-04-01 |
| 8680577 | Recessed gate field effect transistor | Lawrence A. Clevenger, Carl Radens, Yiheng Xu | 2014-03-25 |
| 8653671 | System for relieving stress and improving heat management in a 3D chip stack | — | 2014-02-18 |
| 8603916 | CMP techniques for overlapping layer removal | Paul Ferreira | 2013-12-10 |
| 8569899 | Device and method for alignment of vertically stacked wafers and die | Walter Kleemeier, Paul Ferreira, Ronald K. Sampson | 2013-10-29 |
| 8564137 | System for relieving stress and improving heat management in a 3D chip stack having an array of inter-stack connections | — | 2013-10-22 |
| 8560111 | Method of determining pressure to apply to wafers during a CMP | Walter Kleemeier, Ronald K. Sampson | 2013-10-15 |
| 8476765 | Copper interconnect structure having a graphene cap | Cindy Goldberg, Walter Kleemeier, Ronald K. Sampson | 2013-07-02 |
| 8466560 | Dummy structures having a golden ratio and method for forming the same | Heng Yang | 2013-06-18 |
| 8336148 | System and method for cleaning a charging wafer surface | — | 2012-12-25 |
| 8324622 | Method of repairing probe pads | Laertis Economikos, Robin Van Den Nieuwenhuizen, Wei-Tsu Tseng | 2012-12-04 |
| 7340360 | Method for determining projected lifetime of semiconductor devices with analytical extension of stress voltage window by scaling of oxide thickness | Kurt Taylor, Eugene Zhao, Amit P. Marathe, Rolf Geilenkeuser, Joerg-Oliver Weidner | 2008-03-04 |
| 6664198 | Method of forming a silicon nitride dielectric layer | Fernando Gonzalez, Er-Xuan Ping | 2003-12-16 |