Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107766 | Substrate with embedded stacked through-silicon via die | Houssam Jomaa | 2021-08-31 |
| 10461032 | Substrate with embedded stacked through-silicon via die | Houssam Jomaa | 2019-10-29 |
| 9716084 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Rahul N. Manepalli | 2017-07-25 |
| 9559088 | Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same | Houssam Jomaa | 2017-01-31 |
| 9397079 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Rahul N. Manepalli | 2016-07-19 |
| 9257380 | Forming functionalized carrier structures with coreless packages | Ravi Kiran Nalla, John S. Guzek, Drew W. Delaney, Hamid Azimi | 2016-02-09 |
| 9000599 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Rahul N. Manepalli | 2015-04-07 |
| 8987065 | Forming functionalized carrier structures with coreless packages | Ravi K. Nailla, John S. Guzek, Drew W. Delaney, Hamid Azimi | 2015-03-24 |
| 8901724 | Semiconductor package with embedded die and its methods of fabrication | John S. Guzek, Nicholas R. Watts, Ravi Kiran Nalla | 2014-12-02 |
| 8786066 | Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same | John S. Guzek, Ravi Kiran Nalla, Drew W. Delaney, Suresh Pothukuchi, Mohit Mamodia +2 more | 2014-07-22 |
| 8736065 | Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same | Houssam Jomaa | 2014-05-27 |
| 8618652 | Forming functionalized carrier structures with coreless packages | Ravi Kiran Nalla, John S. Guzek, Drew W. Delaney, Hamid Azimi | 2013-12-31 |
| 8466559 | Forming die backside coating structures with coreless packages | Rahul N. Manepalli, Mohit Mamodia, Dingying Xu, Edward R. Prack | 2013-06-18 |
| 8421245 | Substrate with embedded stacked through-silicon via die | Houssam Jomaa | 2013-04-16 |
| 7952182 | Semiconductor device with package to package connection | Nicholas R. Watts | 2011-05-31 |