HY

Hsueh-An Yang

AE Advanced Semiconductor Engineering: 7 patents #162 of 1,073Top 20%
TSMC: 7 patents #3,492 of 12,232Top 30%
WL Walsin Lihwa: 4 patents #6 of 51Top 15%
NU National Tsing Hua University: 1 patents #672 of 2,036Top 35%
Overall (All Time): #239,295 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9502334 Method of making a semiconductor device package with dummy gate 2016-11-22
9240348 Method of making a semiconductor device package 2016-01-19
9056766 Method of forming a bond ring for a first and second substrate Chun-Wen Cheng 2015-06-16
8836116 Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates 2014-09-16
8810027 Bond ring for a first and second substrate Chun-Wen Cheng 2014-08-19
8633554 MEMS device etch stop Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu +2 more 2014-01-21
8368152 MEMS device etch stop Chia-Hua Chu, Yi Heng Tsai, Kai-Chih Liang, Chia-Pao Shu, Li-Cheng Chu +2 more 2013-02-05
8318511 Integration manufacturing process for MEMS device Mingching Wu, Hung-Yi Lin, Weileun Fang 2012-11-27
8277667 Magnetic element and manufacturing method therefor Weileun Fang, Tsung Lin Tang 2012-10-02
8263493 Silicon chip having through via and method for making the same Pei-Chun Chen, Chien-Hua Chen 2012-09-11
8114699 Integration manufacturing process for MEMS device Migching Wu, Hung-Yi Lin, Weileun Fang 2012-02-14
8030111 Integration manufacturing process for MEMS device Mingching Wu, Hung-Yi Lin, Weileun Fang 2011-10-04
7945062 Microelectromechanical microphone packaging system Wei-Chung Wang, Sung-Mao Wu, Kuo-Pin Yang, Chian-Chi Lin 2011-05-17
7863181 Method for manufacturing a device having a high aspect ratio via Po-Jen Cheng 2011-01-04
7706149 Micro-electro-mechanical-system package and method for manufacturing the same Meng-Jen Wang, Wei-Chung Wang, Ming-Chiang Lee, Wei-Pin Huang, Feng Cheng 2010-04-27
7681779 Method for manufacturing electric connections in wafer 2010-03-23
7651888 Wafer lever fixture and method for packaging micro-electro-mechanical-system devices 2010-01-26
7501342 Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same Wei-Chung Wang, Po-Jen Cheng, Pei-Chun Chen 2009-03-10
7196449 Two-axis device and manufacturing method therefor Mingching Wu, Hung-Yi Lin, Weileun Fang 2007-03-27