Issued Patents All Time
Showing 26–50 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10051733 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu | 2018-08-14 |
| 9899347 | Wire bonded wide I/O semiconductor device | Michael Mostovoy, Gokul Kumar, Ning Ye, Venkatesh Ramachandra, Vinayak Ghatawade +1 more | 2018-02-20 |
| 9362244 | Wire tail connector for a semiconductor device | Chin-Tien Chiu, Cheeman Yu | 2016-06-07 |
| 9337153 | EMI shielding and thermal dissipation for semiconductor device | Peng-Fei Fu, Shan Luo, Zhong Lu, Kaiyou Qian, Chin-Tien Chiu +2 more | 2016-05-10 |
| 9230919 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu | 2016-01-05 |
| 9218953 | Low profile wire bonded USB device | Suresh Upadhyayula, Robert C. Miller, Steven T. Sprouse, Ka Ian Yung | 2015-12-22 |
| 9209159 | Hidden plating traces | Cheeman Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2015-12-08 |
| 9006912 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheemen Yu | 2015-04-14 |
| 8987053 | Semiconductor package including flip chip controller at bottom of die stack | Suresh Upadhyayula | 2015-03-24 |
| 8947883 | Low profile wire bonded USB device | Suresh Upadhyayula, Robert C. Miller, Steven T. Sprouse, Ka Ian Yung | 2015-02-03 |
| 8878368 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu | 2014-11-04 |
| 8878346 | Molded SiP package with reinforced solder columns | Chin-Tien Chiu, Hui Liu, Jiang Zhu, Jack Chang-Chien, Cheemen Yu | 2014-11-04 |
| 8852999 | System-in-a-package based flash memory card | Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath | 2014-10-07 |
| 8728864 | Method of fabricating a memory card using SIP/SMT hybrid technology | Ning Ye, Robert C. Miller, Cheemen Yu, Andre McKenzie | 2014-05-20 |
| 8659133 | Etched surface mount islands in a leadframe package | Suresh Upadhyayula, Bonnie Ming-Yan Chan, Shih-Ping Fan-chiang | 2014-02-25 |
| 8653653 | High density three dimensional semiconductor die package | Cheeman Yu, Chih-Chin Liao | 2014-02-18 |
| 8637972 | Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel | Chih-Chin Liao, Ning Ye, Cheemen Yu, Jack Chang Chien | 2014-01-28 |
| 8637963 | Radiation-shielded semiconductor device | Suresh Upadhyayula, Chih-Chin Liao | 2014-01-28 |
| 8637978 | System-in-a-package based flash memory card | Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath | 2014-01-28 |
| 8575739 | Col-based semiconductor package including electrical connections through a single layer leadframe | Suresh Upadhyayula, Ming-Hsun Lee | 2013-11-05 |
| 8575724 | Semiconductor device having under-filled die in a die stack | Shrikar Bhagath | 2013-11-05 |
| 8487441 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheemen Yu | 2013-07-16 |
| 8482139 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Chin-Tien Chiu, Cheeman Yu, Jack Chang Chien, Ning Liu | 2013-07-09 |
| 8470640 | Method of fabricating stacked semiconductor package with localized cavities for wire bonding | Shrikar Bhagath, Cheemen Yu, Chih-Chin Liao | 2013-06-25 |
| 8461675 | Substrate panel with plating bar structured to allow minimum kerf width | Ken Jian Ming Wang, Chih-Chin Liao, Han-Shiao Chen | 2013-06-11 |