Issued Patents All Time
Showing 76–100 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7867819 | Semiconductor package including flip chip controller at bottom of die stack | Suresh Upadhyayula | 2011-01-11 |
| 7864540 | Peripheral card with sloped edges | — | 2011-01-04 |
| 7822883 | Memory card with two standard sets of contacts and a hinged contact covering mechanism | Robert C. Miller, Joel Bernard Jacobs, Robert A. Howard, Motohide Hatanaka, Robert F. Wallace +2 more | 2010-10-26 |
| 7816181 | Method of under-filling semiconductor die in a die stack and semiconductor device formed thereby | Shrikar Bhagath | 2010-10-19 |
| 7811859 | Method of reducing memory card edge roughness by edge coating | Ong King Hoo, Java Zhu, Ning Ye | 2010-10-12 |
| 7812356 | Method of assembling semiconductor devices with LEDS | Suresh Upadhyayula | 2010-10-12 |
| 7806731 | Rounded contact fingers on substrate/PCB for crack prevention | Cheemen Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2010-10-05 |
| 7795715 | Leadframe based flash memory cards | Shrikar Bhagath | 2010-09-14 |
| 7791191 | Semiconductor device having multiple die redistribution layer | Shrikar Bhagath | 2010-09-07 |
| 7772107 | Methods of forming a single layer substrate for high capacity memory cards | Cheemen Yu, Chih-Chin Liao | 2010-08-10 |
| 7772047 | Method of fabricating a semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu | 2010-08-10 |
| 7772686 | Memory card fabricated using SiP/SMT hybrid technology | Ning Ye, Robert C. Miller, Cheemen Yu, Andre McKenzie | 2010-08-10 |
| 7763980 | Semiconductor die having a distribution layer | Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu | 2010-07-27 |
| 7745234 | Method for reclaiming semiconductor package | King Hoo Ong, Robertito Piaduche, Ning Ye | 2010-06-29 |
| 7746661 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheemen Yu | 2010-06-29 |
| 7728411 | COL-TSOP with nonconductive material for reducing package capacitance | Ming-Hsun Lee, Cheemen Yu | 2010-06-01 |
| 7663216 | High density three dimensional semiconductor die package | Cheemen Yu, Chih-Chin Liao | 2010-02-16 |
| 7615861 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Chin-Tien Chiu, Cheemen Yu, Jack Chang Chien, Ning Liu | 2009-11-10 |
| 7615409 | Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages | Cheemen Yu, Chih-Chin Liao | 2009-11-10 |
| 7611927 | Method of minimizing kerf width on a semiconductor substrate panel | Chih-Chin Liao, Ning Ye, Cheemen Yu, Jack Chang Chien | 2009-11-03 |
| 7592699 | Hidden plating traces | Cheemen Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2009-09-22 |
| 7560304 | Method of making a semiconductor device having multiple die redistribution layer | Shrikar Bhagath | 2009-07-14 |
| 7554813 | Memory card with two standard sets of contacts and a contact covering mechanism | Robert C. Miller, Joel Bernard Jacobs, Robert A. Howard, Motohide Hatanaka, Robert F. Wallace +3 more | 2009-06-30 |
| 7550834 | Stacked, interconnected semiconductor packages | Cheemen Yu, Chih-Chin Liao | 2009-06-23 |
| 7495255 | Test pads on flash memory cards | Shrikar Bhagath | 2009-02-24 |