Issued Patents All Time
Showing 51–75 of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8432043 | Stacked wire bonded semiconductor package with low profile bond line | Shrikar Bhagath | 2013-04-30 |
| 8395246 | Two-sided die in a four-sided leadframe based package | Cheemen Yu, Vani Verma | 2013-03-12 |
| 8373268 | Semiconductor package including flip chip controller at bottom of die stack | Suresh Upadhyayula | 2013-02-12 |
| 8354749 | Method for efficiently producing removable peripheral cards | — | 2013-01-15 |
| 8349655 | Method of fabricating a two-sided die in a four-sided leadframe based package | Cheeman Yu, Vani Verma | 2013-01-08 |
| 8318535 | Method of fabricating a memory card using SiP/SMT hybrid technology | Ning Ye, Robert C. Miller, Cheemen Yu, Andre McKenzie | 2012-11-27 |
| 8294251 | Stacked semiconductor package with localized cavities for wire bonding | Shrikar Bhagath, Cheemen Yu, Chih-Chin Liao | 2012-10-23 |
| 8241953 | Method of fabricating stacked wire bonded semiconductor package with low profile bond line | Shrikar Bhagath | 2012-08-14 |
| 8232145 | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards | Che-Jung Chang, Chin-Tien Chiu, Cheeman Yu, Jack Chang Chien, Ning Liu | 2012-07-31 |
| 8217522 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu | 2012-07-10 |
| 8212360 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu | 2012-07-03 |
| 8129272 | Hidden plating traces | Cheeman Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2012-03-06 |
| 8110439 | Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages | Cheeman Yu, Chi-Chin Liao | 2012-02-07 |
| 8097495 | Die package with asymmetric leadframe connection | Ming-Hsun Lee, Chih-Chin Liao, Cheemen Yu | 2012-01-17 |
| 8058099 | Method of fabricating a two-sided die in a four-sided leadframe based package | Cheemen Yu, Vani Verma | 2011-11-15 |
| 8053880 | Stacked, interconnected semiconductor package | Cheeman Yu, Chih-Chin Liao | 2011-11-08 |
| 8053276 | Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages | Cheeman Yu, Chi-Chin Liao | 2011-11-08 |
| 8022519 | System-in-a-package based flash memory card | Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath | 2011-09-20 |
| 8022417 | Method of assembling semiconductor devices with LEDS | Suresh Upadhyayula | 2011-09-20 |
| 8008132 | Etched surface mount islands in a leadframe package | Suresh Upadhyayula, Bonnie Ming-Yan Chan, Shih-Ping Fan-chiang | 2011-08-30 |
| 7994647 | Method of reducing memory card edge roughness by edge coating | Ong King Hoo, Java Zhu, Ning Ye | 2011-08-09 |
| 7967184 | Padless substrate for surface mounted components | Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Chin-Tien Chiu, Jack Chang Chien +2 more | 2011-06-28 |
| 7952179 | Semiconductor package having through holes for molding back side of package | Chin-Tien Chiu, Chih-Chin Liao, Cheemen Yu, Ning Ye, Jack Chang Chien | 2011-05-31 |
| 7939944 | Semiconductor die having a redistribution layer | Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheeman Yu | 2011-05-10 |
| 7939382 | Method of fabricating a semiconductor package having through holes for molding back side of package | Chin-Tien Chiu, Chih-Chin Liao, Cheemen Yu, Ning Ye, Jack Chang Chien | 2011-05-10 |