Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676873 | Semiconductor package having sealant bridge | Dinesh Padmanabhan Ramalekshmi Thanu, Venkata Suresh R. Guthikonda, John J. Beatty, Yonghao An, Marco Aurelio Cartas Ayala +2 more | 2023-06-13 |
| 11652018 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, John J. Beatty, Syadwad Jain, Nachiket R. Raravikar | 2023-05-16 |
| 11062970 | Heat spreader edge standoffs for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, John J. Beatty, Syadwad Jain, Nachiket R. Raravikar | 2021-07-13 |
| 10643938 | Standoff spacers for managing bondline thickness in microelectronic packages | Dinesh P. R. Thanu, John J. Beatty, Sachin Deshmukh | 2020-05-05 |
| 10580717 | Multiple-chip package with multiple thermal interface materials | Boxi LIU, Syadwad Jain, James C. Matayabas, Jr. | 2020-03-03 |
| 9943931 | High performance transient uniform cooling solution for thermal compression bonding process | Zhihua Li, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc +3 more | 2018-04-17 |
| 9748199 | Thermal compression bonding process cooling manifold | Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy, George Kostiew +1 more | 2017-08-29 |
| 9735089 | Thermal management for flexible integrated circuit packages | Siddarth Kumar | 2017-08-15 |
| 9548284 | Reduced expansion thermal compression bonding process bond head | Pramod Malatkar, James Neeb | 2017-01-17 |
| 9434029 | High performance transient uniform cooling solution for thermal compression bonding process | Zhihua Li, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc +3 more | 2016-09-06 |
| 9282650 | Thermal compression bonding process cooling manifold | Zhihua Li, Joseph B. Petrini, Steven B. Roach, Shankar Devasenathipathy, George Kostiew +1 more | 2016-03-08 |
| 8632670 | Controlled flow of a thin liquid film by electrowetting | Suresh V. Garimella, Niru Kumari | 2014-01-21 |