Issued Patents All Time
Showing 25 most recent of 183 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923469 | Vertical resistor adjacent inactive gate over trench isolation | Hui Zang, Guowei Xu, Jiehui Shu, Ruilong Xie, Yurong Wen +2 more | 2021-02-16 |
| 10832967 | Tapered fin-type field-effect transistors | Hui Zang, Ruilong Xie | 2020-11-10 |
| 10586736 | Hybrid fin cut with improved fin profiles | Haiting Wang, Ruilong Xie, Shesh Mani Pandey, Hui Zang, Scott Beasor | 2020-03-10 |
| 10510749 | Resistor within single diffusion break, and related method | Hui Zang, Ruilong Xie, Laertis Economikos | 2019-12-17 |
| 10475791 | Transistor fins with different thickness gate dielectric | Hui Zang, Laertis Economikos, Chun Yu Wong, Jiehui Shu, Shesh Mani Pandey | 2019-11-12 |
| 10418272 | Methods, apparatus, and system for a semiconductor device comprising gates with short heights | Jiehui Shu, Hui Zang, John H. Zhang, Haigou Huang, Jinping Liu | 2019-09-17 |
| 10276374 | Methods for forming fins | Jiehui Shu, Jinping Liu | 2019-04-30 |
| 9761452 | Devices and methods of forming SADP on SRAM and SAQP on logic | Jiehui Shu, Daniel Jaeger, Haifeng Sheng, Jinping Liu | 2017-09-12 |
| 9754792 | Fin cutting process for manufacturing FinFET semiconductor devices | — | 2017-09-05 |
| 9704759 | Methods of forming CMOS based integrated circuit products using disposable spacers | Wen-Pin Peng, Min-hwa Chi | 2017-07-11 |
| 9396995 | MOL contact metallization scheme for improved yield and device reliability | Suraj K. Patil, Min-hwa Chi, Wen-Pin Peng | 2016-07-19 |
| 9385124 | Methods of forming reduced thickness spacers in CMOS based integrated circuit products | Wen-Pin Peng, Min-hwa Chi | 2016-07-05 |
| 9318440 | Formation of carbon-rich contact liner material | Huy Cao, Songkram Srivathanakul, Huang Liu, Boaz Alperson | 2016-04-19 |
| 9159418 | High density stacked CNT memory cube arrays with memory selectors | Jonathan W. Ward, Adrian N. Robinson | 2015-10-13 |
| 9130019 | Formation of carbon-rich contact liner material | Huy Cao, Songkram Srivathanakul, Huang Liu, Boaz Alperson | 2015-09-08 |
| 8822352 | Devices containing carbon nanomaterial electrical interconnects overcoated with metal nitride films and methods for production thereof | Jonathan W. Ward | 2014-09-02 |
| 8816447 | Transistor with reduced depletion field width | Shuang Meng, Gurtej S. Sandhu | 2014-08-26 |
| 8691015 | Method and system for binding halide-based contaminants | Cem Basceri, Donald L. Westmoreland | 2014-04-08 |
| 8618662 | Devices containing carbon nanomaterial electrical interconnects overcoated with metal nitride films and methods for production thereof | Jonathan W. Ward | 2013-12-31 |
| 8604459 | Electrical devices containing a carbon nanotube switching layer with a passivation layer disposed thereon and methods for production thereof | Jonathan W. Ward | 2013-12-10 |
| 8587989 | NRAM arrays with nanotube blocks, nanotube traces, and nanotube planes and methods of making same | H. Montgomery Manning, Thomas Rueckes, Claude L. Bertin, Jonathan W. Ward | 2013-11-19 |
| 8470686 | Method of increasing deposition rate of silicon dioxide on a catalyst | Chris Hill | 2013-06-25 |
| 8435886 | Method and system for binding halide-based contaminants | Cem Basceri, Donald L. Westmoreland | 2013-05-07 |
| 8362576 | Transistor with reduced depletion field width | Shuang Meng, Gurtej S. Sandhu | 2013-01-29 |
| 8257497 | Insitu post atomic layer deposition destruction of active species | Demetrius Sarigiannis, Shuang Meng | 2012-09-04 |