Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8470686 | Method of increasing deposition rate of silicon dioxide on a catalyst | Garo Derderian | 2013-06-25 |
| 8158488 | Method of increasing deposition rate of silicon dioxide on a catalyst | Garo Derderian | 2012-04-17 |
| 8153502 | Methods for filling trenches in a semiconductor material | Li Li, Ronald A. Weimer, Richard L. Stocks | 2012-04-10 |
| 8110891 | Method of increasing deposition rate of silicon dioxide on a catalyst | Garo Derderian | 2012-02-07 |
| 7667258 | Double-sided container capacitors using a sacrificial layer | Gurtej S. Sandhu, Kevin R. Shea, Kevin J. Torek | 2010-02-23 |
| 7470632 | Method of depositing a silicon dioxide comprising layer doped with at least one of P, B and Ge | Weimin Li, Gurtej S. Sandhu | 2008-12-30 |
| 7429541 | Method of forming trench isolation in the fabrication of integrated circuitry | Garo Derderian | 2008-09-30 |
| 7361614 | Method of depositing a silicon dioxide comprising layer in the fabrication of integrated circuitry | Garo Derderian | 2008-04-22 |
| 7329576 | Double-sided container capacitors using a sacrificial layer | Gurtej S. Sandhu, Kevin R. Shea, Kevin J. Torek | 2008-02-12 |
| 7250378 | Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry | Garo Derderian | 2007-07-31 |
| 7250380 | Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry | Garo Derderian | 2007-07-31 |
| 7157385 | Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry | Garo Derderian | 2007-01-02 |
| 6982228 | Methods of etching a contact opening over a node location on a semiconductor substrate | Mark E. Jost | 2006-01-03 |
| 6940171 | Multi-layer dielectric and method of forming same | — | 2005-09-06 |
| 6930058 | Method of depositing a silicon dioxide comprising layer doped with at least one of P, B and Ge | Weimin Li, Gurtej S. Sandhu | 2005-08-16 |
| 6905956 | Multi-layer dielectric and method of forming same | — | 2005-06-14 |
| 6828252 | Method of etching a contact opening | Mark E. Jost | 2004-12-07 |
| 6787877 | Method for filling structural gaps and integrated circuitry | — | 2004-09-07 |
| 6596641 | Chemical vapor deposition methods | Mark E. Jost | 2003-07-22 |
| 6500730 | Method for filling structural gaps and integrated circuitry | — | 2002-12-31 |
| 6433378 | Integrated circuits having material within structural gaps | — | 2002-08-13 |
| 6384466 | Multi-layer dielectric and method of forming same | — | 2002-05-07 |
| 6306766 | Method of forming a crystalline phase material, electrically conductive line and refractory metal silicide | Gurtej S. Sandhu, Sujit Sharan | 2001-10-23 |
| 6175155 | Selectively formed contact structure | — | 2001-01-16 |
| 6171948 | Method for filling structural gaps and intergrated circuitry | — | 2001-01-09 |