| 12005148 |
Coolant-cooled heat sink(s) with associated ultra-violet light assembly |
Hongqing Zhang, Frank L. Pompeo, James A. Busby, Jay A. Bunt, Joyce E. Molinelli Acocella +2 more |
2024-06-11 |
| 11940271 |
High power device fault localization via die surface contouring |
Jay A. Bunt, Frank L. Pompeo, Richard W. Oldrey, John D. Sylvestri, Phong T. Tran |
2024-03-26 |
| 11716808 |
Tamper-respondent assemblies with porous heat transfer element(s) |
Hongqing Zhang, Arthur J. Higby, Philipp K Buchling Rego, Jay A. Bunt, James A. Busby +1 more |
2023-08-01 |
| 11614324 |
Non-destructive bond line thickness measurement of thermal interface material on silicon packages |
Hongqing Zhang, Jay A. Bunt, Joyce E. Molinelli Acocella, Yu Luo |
2023-03-28 |
| 11430710 |
Lid/heat spreader having targeted flexibility |
Shidong Li, Jay A. Bunt, Kenneth C. Marston, Hilton T. Toy, Hongqing Zhang |
2022-08-30 |
| 11156409 |
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover |
Hongqing Zhang, Jay A. Bunt, Joyce E. Molinelli Acocella, Frank L. Pompeo, Jeffrey A. Zitz |
2021-10-26 |
| 11158562 |
Conformal integrated circuit (IC) device package lid |
Hongqing Zhang, Jay A. Bunt, Jeffrey A. Zitz, Sushumna Iruvanti |
2021-10-26 |
| 10842043 |
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins |
Hongqing Zhang, Jay A. Bunt, Joyce E. Molinelli Acocella, Jeffrey A. Zitz, Frank L. Pompeo |
2020-11-17 |
| 9673177 |
Selectively soluble standoffs for chip joining |
Benjamin V. Fasano, Mark W. Kapfhammer, Thomas E. Lombardi, Thomas Weiss |
2017-06-06 |
