Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10317952 | Compartment for magnet placement | Sandeep S. Iyer, Amanuel M. Abebaw, Mark Saltas, Mayank Patel, Suriyakala Ramalingam +1 more | 2019-06-11 |
| 10103037 | Flexible microelectronic systems and methods of fabricating the same | Aleksandar Aleksov, Dilan Seneviratne, Ching-Ping Janet Shen, Daniel N. Sobieski | 2018-10-16 |
| 9691727 | Pad-less interconnect for electrical coreless substrate | Javier Soto Gonzalez, Robert M. Nickerson, Debendra Mallik | 2017-06-27 |
| 9299602 | Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package | Qinglei Zhang, Tao Wu, Mark S. Hlad | 2016-03-29 |
| 8450857 | Through mold via polymer block package | Mihir K. Roy, Islam A. Salama, Robert L. Sankman | 2013-05-28 |
| 8278214 | Through mold via polymer block package | Mihir K. Roy, Islam A. Salama, Robert L. Sankman | 2012-10-02 |
| 7825022 | Method of enabling solder deposition on a substrate and electronic package formed thereby | Ravi Kiran Nalla | 2010-11-02 |
| 7538429 | Method of enabling solder deposition on a substrate and electronic package formed thereby | Ravi Kiran Nalla | 2009-05-26 |
| 7432202 | Method of substrate manufacture that decreases the package resistance | Bijay S. Saha, Munehiro Toyama, Ehab A. Nasir, Omar J. Bchir | 2008-10-07 |