Issued Patents All Time
Showing 76–100 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8541828 | Methods for depositing high-K dielectrics | Edward Haywood, Sandra G. Malhotra, Xiangxin Rui, Sunil Shanker | 2013-09-24 |
| 8501505 | Methods of combinatorial processing for screening multiple samples on a semiconductor substrate | Guarav Verma, Tony P. Chiang, Sandra G. Malhotra, Prashant B. Phatak, Kurt H. Weiner | 2013-08-06 |
| 8466446 | Atomic layer deposition of metal oxide materials for memory applications | Yun Wang, Vidyut Gopal, Dipankar Pramanik, Tony Chiag | 2013-06-18 |
| 8440990 | Nonvolatile memory device having an electrode interface coupling region | Yun Wang, Tony P. Chiang | 2013-05-14 |
| 8383430 | Methods of combinatorial processing for screening multiple samples on a semiconductor substrate | Guarav Verma, Tony P. Chiang, Sandra G. Malhotra, Prashant B. Phatak, Kurt H. Weiner | 2013-02-26 |
| 8343813 | Resistive-switching memory elements having improved switching characteristics | Ronald J. Kuse, Tony P. Chiang | 2013-01-01 |
| 8288297 | Atomic layer deposition of metal oxide materials for memory applications | Yun Wang, Vidyut Gopal, Dipankar Pramanik, Tony Chiag | 2012-10-16 |
| 8278735 | Yttrium and titanium high-k dielectric films | Indranil De, Tony P. Chiang, Edward Haywood, Hanhong Chen, Nobi Fuchigami +3 more | 2012-10-02 |
| 8143619 | Methods of combinatorial processing for screening multiple samples on a semiconductor substrate | Gaurav Verma, Kurt H. Weiner, Prashant B. Phatak, Sandra G. Malhotra, Tony P. Chiang | 2012-03-27 |
| 7968452 | Titanium-based high-K dielectric films | Hanhong Chen, Pragati Kumar, Sunil Shanker, Edward Haywood, Sandra G. Malhotra +3 more | 2011-06-28 |
| 7927947 | Methods for depositing high-K dielectrics | Xiangxin Rui, Sunil Shanker, Sandra G. Malhotra, Edward Haywood | 2011-04-19 |
| 7824935 | Methods of combinatorial processing for screening multiple samples on a semiconductor substrate | Gaurav Verma, Kurt H. Weiner, Prashant B. Phatak, Sandra G. Malhotra, Tony P. Chiang | 2010-11-02 |
| 7294242 | Collimated and long throw magnetron sputtering of nickel/iron films for magnetic recording head applications | Seh Kwang Lee, Thomas Brezoczky, Sesh Ramaswami | 2007-11-13 |
| 6992012 | Method and apparatus for forming improved metal interconnects | Tony P. Chiang, Barry Chin | 2006-01-31 |
| 6881673 | Integrated deposition process for copper metallization | Peijun Ding, Barry Chin, Bingxi Sun | 2005-04-19 |
| 6709987 | Method and apparatus for forming improved metal interconnects | Tony P. Chiang, Barry Chin | 2004-03-23 |
| 6566259 | Integrated deposition process for copper metallization | Peijun Ding, Barry Chin, Bingxi Sun | 2003-05-20 |
| 6559061 | Method and apparatus for forming improved metal interconnects | Tony P. Chiang, Barry Chin | 2003-05-06 |
| 6500762 | Method of depositing a copper seed layer which promotes improved feature surface coverage | Hong Mei Zhang, John C. Forster | 2002-12-31 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Robin Cheung, Peijun Ding +3 more | 2002-08-20 |
| 6391776 | Method of depositing a copper seed layer which promotes improved feature surface coverage | Hong Mei Zhang, John C. Forster | 2002-05-21 |
| 6387805 | Copper alloy seed layer for copper metallization | Peijun Ding, Tony P. Chiang, Bingxi Sun, Barry Chin | 2002-05-14 |
| 6352926 | Structure for improving low temperature copper reflow in semiconductor features | Peijun Ding, Barry Chin | 2002-03-05 |
| 6294396 | Monitoring barrier metal deposition for metal interconnect | Takeshi Nogami, Susan H. Chen | 2001-09-25 |
| 6287977 | Method and apparatus for forming improved metal interconnects | Tony P. Chiang, Barry Chin | 2001-09-11 |