Issued Patents All Time
Showing 101–108 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6217715 | Coating of vacuum chambers to reduce pump down time and base pressure | Bingxi Sun | 2001-04-17 |
| 6184137 | Structure and method for improving low temperature copper reflow in semiconductor features | Peijun Ding, Barry Chin | 2001-02-06 |
| 6174811 | Integrated deposition process for copper metallization | Peijun Ding, Barry Chin, Bingxi Sun | 2001-01-16 |
| 6160315 | Copper alloy via structure | Tony P. Chiang, Peijun Ding, Barry Chin, Bingxi Sun | 2000-12-12 |
| 6149776 | Copper sputtering target | Howard H. Tang, Richard Hong, Peijun Ding | 2000-11-21 |
| 6121141 | Method of forming a void free copper interconnects | Christy Mei-Chu Woo, Dirk Brown, Young-Chang Joo | 2000-09-19 |
| 6066892 | Copper alloy seed layer for copper metallization in an integrated circuit | Peijun Ding, Tony P. Chiang, Bingxi Sun, Barry Chin | 2000-05-23 |
| 6037257 | Sputter deposition and annealing of copper alloy metallization | Tony P. Chiang, Peijun Ding, Barry Chin, Bingxi Sun | 2000-03-14 |