Issued Patents All Time
Showing 51–75 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943792 | 3D stacked-in-recess system in package | Bok Eng Cheah, Jackson Chung Peng Kong, Howe Yin Loo | 2021-03-09 |
| 10943864 | Programmable redistribution die | Eng Huat Goh, J-Wing Teh, Bok Eng Cheah | 2021-03-09 |
| 10923415 | Semiconductor package having integrated stiffener region | Eng Huat Goh, Jiun Hann Sir, Shawna M. Liff, Feras Eid | 2021-02-16 |
| 10856454 | Electromagnetic interference (EMI) shield for circuit card assembly (CCA) | Yew San Lim, Jia Yan Go, Tin Poay Chuah, Eng Huat Goh | 2020-12-01 |
| 10840177 | Interposer with flexible portion | Bok Eng Cheah, Jackson Chung Peng Kong, Tin Poay Chuah | 2020-11-17 |
| 10796999 | Floating-bridge interconnects and methods of assembling same | Boon Ping Koh, Eng Huat Goh, Jiun Hann Sir, Khang Choong Yong, Wil Choon Song | 2020-10-06 |
| 10716209 | Fiber weave-sandwiched differential pair routing technique | Bok Eng Cheah, Eng Huat Goh, Jackson Chung Peng Kong, Khang Choong Yong | 2020-07-14 |
| 10643983 | Extended stiffener for platform miniaturization | Eng Huat Goh, Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Howe Yin Loo | 2020-05-05 |
| 10633898 | Micro-hinge for an electronic device | Bok Eng Cheah, Howe Yin Loo, Jackson Chung Peng Kong, Poh Tat Oh | 2020-04-28 |
| 10609813 | Capacitive interconnect in a semiconductor package | Eng Huat Goh, Fern Nee Tan, Khang Choong Yong, Jiun Hann Sir | 2020-03-31 |
| 10515912 | Integrated circuit packages | Jiun Hann Sir, Eng Huat Eh Goh, Mooi Ling Chang | 2019-12-24 |
| 10503211 | Multi-orientation display device | Chee Chun Yee, David W. Browning, Bok Eng Cheah, Jackson Chung Peng Kong, Howe Yin Loo +1 more | 2019-12-10 |
| 10319698 | Microelectronic device package having alternately stacked die | Bok Eng Cheah, Jackson Chung Peng Kong | 2019-06-11 |
| 10317938 | Apparatus utilizing computer on package construction | Eng Huat Goh, Khai Ern See, Damien Weng Kong Chong, Ping Ping Ooi, Chu Aun Lim +6 more | 2019-06-11 |
| 10297541 | Multiple-component substrate for a microelectronic device | Mooi Ling Chang, Eng Huat Goh, Say Thong Tony Tan, Tin Poay Chuah | 2019-05-21 |
| 10256213 | Reduced-height electronic memory system and method | Eng Huat Goh, Jiun Hann Sir | 2019-04-09 |
| 10256519 | Stranded transmission line and uses thereof | Wil Choon Song, Khang Choong Yong, Eng Huat Goh, Boon Ping Koh | 2019-04-09 |
| 10163777 | Interconnects for semiconductor packages | Seok Ling Lim, Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong, Jia Yan Go +1 more | 2018-12-25 |
| 10153253 | Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus | Howe Yin Loo, Eng Huat Goh, Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong | 2018-12-11 |
| 10085342 | Microelectronic device having an air core inductor | Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Chin Lee Kuan, Howe Yin Loo | 2018-09-25 |
| 10083922 | Inductor interconnect | Chin Lee Kuan, Eng Huat Goh, Khang Choong Yong, Bok Eng Cheah, Jackson Chung Peng Kong +1 more | 2018-09-25 |
| 10041282 | Micro-hinge for an electronic device | Bok Eng Cheah, Howe Yin Loo, Chung Peng Jackson Kong, Poh Tat Oh | 2018-08-07 |
| 10036187 | Micro-hinge for an electronic device | Bok Eng Cheah, Howe Yin Loo, Chung Peng Jackson Kong, Poh Tat Oh | 2018-07-31 |
| 9972589 | Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer | Eng Huat Goh, Jiun Hann Sir, Seok Ling Lim, Hoay Tien Teoh | 2018-05-15 |
| 9960224 | Three capacitor stack and associated methods | Eng Huat Goh, Jiun Hann Sir, Han Kung Chua, Hoay Tien Teoh | 2018-05-01 |