Issued Patents All Time
Showing 26–50 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11596052 | Integrated voltage regulator for high performance devices | Wei Cheang Lau, Yew San Lim | 2023-02-28 |
| 11587844 | Electronic device package on package (POP) | Eng Huat Goh, Jiun Hann Sir, Xi Guo | 2023-02-21 |
| 11589460 | System in package dual connector | Tin Poay Chuah, Chee Chun Yee, Yew San Lim, Eng Huat Goh | 2023-02-21 |
| 11586473 | Methods and apparatus for allocating a workload to an accelerator using machine learning | Divya Vijayaraghavan, Denica N. Larsen, Kooi Chi Ooi, Lady Nataly Pinilla Pico | 2023-02-21 |
| 11556157 | Diagonal printed circuit boards systems | Chee Chun Yee, Yew San Lim, Jeff Ku, Tin Poay Chuah | 2023-01-17 |
| 11552403 | Slot antenna on a printed circuit board (PCB) | Eng Huat Goh, Boon Ping Koh, Wil Choon Song, Khang Choong Yong | 2023-01-10 |
| 11538633 | Combination stiffener and capacitor | Eng Huat Goh, Jiun Hann Sir | 2022-12-27 |
| 11487326 | Elevated docking station for different mobile devices | Jeff Ku, Tin Poay Chuah, Yew San Lim, Chee Chun Yee | 2022-11-01 |
| 11481001 | System for dual displays | Chee Chun Yee, Tin Poay Chuah, Yew San Lim, Jeff Ku | 2022-10-25 |
| 11445608 | Chassis interconnect for an electronic device | Chee How Lim, Eng Huat Goh, Jon Sern Lim, Khai Ern See, Tin Poay Chuah +1 more | 2022-09-13 |
| 11393760 | Floating-bridge interconnects and methods of assembling same | Boon Ping Koh, Eng Huat Goh, Jiun Hann Sir, Khang Choong Yong, Wil Choon Song | 2022-07-19 |
| 11348909 | Multi-die packages with efficient memory storage | Maruti Gupta Hyde, Nageen Himayat, Linda L. Hurd, Van H. Le, Gayathri Jeganmohan +1 more | 2022-05-31 |
| 11343906 | Stacked scalable voltage regulator module for platform area miniaturization | Tai Loong Wong, Fern Nee Tan, Tin Poay Chuah, Siang Yeong Tan | 2022-05-24 |
| 11320883 | Multi-die stacks with power management | Rajashree Baskaran, Maruti Gupta Hyde, Van H. Le, Hebatallah Saadeldeen | 2022-05-03 |
| 11289414 | Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package | Eng Huat Goh, Jiun Hann Sir | 2022-03-29 |
| 11264315 | Electronic package with passive component between substrates | Eng Huat Goh, Jiun Hann Sir, Hoay Tien Teoh, Jimmy Huang | 2022-03-01 |
| 11264160 | Extended package air core inductor | Eng Huat Goh, Jiun Hann Sir, Chin Lee Kuan, Siew Fong Yap | 2022-03-01 |
| 11211714 | Slot antenna on a printed circuit board (PCB) | Eng Huat Goh, Boon Ping Koh, Wil Choon Song, Khang Choong Yong | 2021-12-28 |
| 11177226 | Flexible shield for semiconductor devices | Bok Eng Cheah, Eng Huat Goh, Jackson Chung Peng Kong, Khang Choong Yong | 2021-11-16 |
| 11172581 | Multi-planar circuit board having reduced z-height | Eng Huat Goh, Tin Poay Chuah, Han Kung Chua | 2021-11-09 |
| 11133261 | Electronic device packaging | Eng Huat Goh, Chee Kheong Yoon, Jia Yan Go | 2021-09-28 |
| 11030012 | Methods and apparatus for allocating a workload to an accelerator using machine learning | Divya Vijayaraghavan, Denica N. Larsen, Kooi Chi Ooi, Lady Nataly Pinilla Pico | 2021-06-08 |
| 11009890 | Computer-assisted or autonomous driving assisted by roadway navigation broadcast | Rajashree Baskaran, Maruti Gupta Hyde, Van H. Le, Hebatallah Saadeldeen | 2021-05-18 |
| 11006514 | Three-dimensional decoupling integration within hole in motherboard | Jia Yan Go, Tin Poay Chuah, Seok Ling Lim, Howe Yin Loo | 2021-05-11 |
| 10957649 | Overpass dice stacks and methods of using same | Bok Eng Cheah, Jackson Chung Peng Kong | 2021-03-23 |