JH

Jun He

IN Intel: 27 patents #1,429 of 30,777Top 5%
CT Changxin Memory Technologies: 25 patents #15 of 743Top 3%
TSMC: 18 patents #1,811 of 12,232Top 15%
AC Anhui Anuki Technologies Co.: 11 patents #1 of 9Top 15%
AU Anhui University: 9 patents #3 of 137Top 3%
UN Unknown: 3 patents #7,366 of 83,584Top 9%
GM Grace Semiconductor Manufacturing: 3 patents #2 of 36Top 6%
YC Yangtze Memory Technologies Co.: 1 patents #419 of 626Top 70%
University of California: 1 patents #8,022 of 18,278Top 45%
BC Brightek Optoelectronic Co.: 1 patents #5 of 7Top 75%
CL Cambricon Technologies Corporation Limited: 1 patents #41 of 64Top 65%
📍 Daguantang, AZ: #1 of 1 inventorsTop 100%
Overall (All Time): #16,199 of 4,157,543Top 1%
94
Patents All Time

Issued Patents All Time

Showing 76–94 of 94 patents

Patent #TitleCo-InventorsDate
7679145 Transistor performance enhancement using engineered strains Zhiyong Ma, Jose Maiz, Mark Bohr, Martin D. Giles, Guanghai Xu 2010-03-16
7662674 Methods of forming electromigration and thermal gradient based fuse structures Jose Maiz, Mark Bohr 2010-02-16
7544966 Three-terminal electrical bistable devices Yang Yang, Liping Ma 2009-06-09
7524754 Interconnect shunt used for current distribution and reliability redundancy Mark Bohr, Fay Hua, Dustin P. Wood 2009-04-28
7402519 Interconnects having sealing structures to enable selective metal capping layers Kevin J. Fischer, Ying Zhou, Peter K. Moon 2008-07-22
7402509 Method of forming self-passivating interconnects and resulting devices Mauro J. Kobrinsky, Kevin P. O'Brien, Patrick Morrow, Ying Zhou, Shriram Ramanathan 2008-07-22
7348283 Mechanically robust dielectric film and stack Jihperng Leu 2008-03-25
7332741 Multidirectional leakage path test structure Mon-Chin Tsai, Xinghua Pu, Ning Jiang 2008-02-19
7208830 Interconnect shunt used for current distribution and reliability redundancy Mark Bohr, Fay Hua, Dustin P. Wood 2007-04-24
7175970 Mechanically robust interconnect for low-k dielectric material using post treatment Jihperng Leu 2007-02-13
7151051 Interconnect structure for an integrated circuit and method of fabrication Jose Maiz, Hyun-Mog Park 2006-12-19
7087452 Edge arrangements for integrated circuit chips Subhash M. Joshi, Tom P. Leavy, Binny Arcot 2006-08-08
7071554 Stress mitigation layer to reduce under bump stress concentration Makarem A. Hussein 2006-07-04
6998216 Mechanically robust interconnect for low-k dielectric material using post treatment Jihperng Leu 2006-02-14
6998868 Test key for bridge and continuity testing Dong Li, DeXue Leng, Mon-Chin Tsai 2006-02-14
6919637 Interconnect structure for an integrated circuit and method of fabrication Jose Maiz, Hyun-Mog Park 2005-07-19
6857242 Cushion block for build-up surface made by strips 2005-02-22
6838299 Forming defect prevention trenches in dicing streets Rose Mulligan, Thomas Marieb, Susanne Menezes, Steven Towle 2005-01-04
D484620 Cushion block for built-up floor 2003-12-30