Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7405024 | Lithographic mask, and method for covering a mask layer | Oliver Broermann | 2008-07-29 |
| 7268080 | Method for printing contacts on a substrate | — | 2007-09-11 |
| 7259107 | Method of forming isolated features of semiconductor devices | — | 2007-08-21 |
| 7224030 | Method and apparatus for producing rectangular contact holes utilizing side lobe formation | — | 2007-05-29 |
| 7157371 | Barrier layer and a method for suppressing diffusion processes during the production of semiconductor devices | Thomas Hecht, Harald Seidl, Martin Gutsche, Stefan Jakschik, Stephan Kudelka +1 more | 2007-01-02 |
| 7157194 | Method for exposing a substrate with a structure pattern which compensates for the optical proximity effect | — | 2007-01-02 |
| 7074528 | Effective assist pattern for nested and isolated contacts | Jochen Schacht, Benjamin Szu-Min Lin | 2006-07-11 |
| 7049241 | Method for forming a trench in a layer or a layer stack on a semiconductor wafer | Matthias Goldbach, Tobias Mono | 2006-05-23 |
| 6897943 | Method and apparatus for aerial image improvement in projection lithography using a phase shifting aperture | Tobias Mono | 2005-05-24 |
| 6767682 | Method for producing quadratic contact holes utilizing side lobe formation | — | 2004-07-27 |
| 6740555 | Semiconductor structures and manufacturing methods | Helmut Tews, Alexander Michaelis, Stephan Kudelka, Raj Jammy, Ulrike Gruening | 2004-05-25 |
| 6740595 | Etch process for recessing polysilicon in trench structures | Stephan Kudelka, Helmut Tews, Alexander Michaelis, Martin Popp, Kristin Schupke +1 more | 2004-05-25 |
| 6620724 | Low resistivity deep trench fill for DRAM and EDRAM applications | Helmut Tews, Irene McStay, Manfred Hauf, Matthias Goldbach, Bernhard Sell +5 more | 2003-09-16 |
| 6613642 | Method for surface roughness enhancement in semiconductor capacitor manufacturing | Stephen Rahn, Irene McStay, Helmut Tews, Stephan Kudelka, Rajarao Jammy | 2003-09-02 |
| 6605396 | Resolution enhancement for alternating phase shift masks | Tobias Mono, Veit Klee | 2003-08-12 |
| 6605838 | Process flow for thick isolation collar with reduced length | Jack A. Mandelman, Rama Divakaruni, Gerd Fehlauer, Stephan Kudelka, Helmut Tews | 2003-08-12 |
| 6605860 | Semiconductor structures and manufacturing methods | Helmut Tews, Alexander Michaelis, Stephan Kudelka, Raj Jammy, Ulrike Gruening | 2003-08-12 |
| 6599798 | Method of preparing buried LOCOS collar in trench DRAMS | Helmut Tews, Stephan Kudelka, Rolf Weis | 2003-07-29 |
| 6590657 | Semiconductor structures and manufacturing methods | Christian Summerer, Shahid Butt, Gerhard Kunkel | 2003-07-08 |
| 6576550 | ‘Via first’ dual damascene process for copper metallization | Gabriela Brase, Karen L. Holloway | 2003-06-10 |
| 6559002 | Rough oxide hard mask for DT surface area enhancement for DT DRAM | Stephan Kudelka, Helmut Tews, Stephen Rahn, Irene McStay | 2003-05-06 |
| 6548357 | Modified gate processing for optimized definition of array and logic devices on same chip | Mary E. Weybright, Gary B. Bronner, Richard A. Conti, Ramachandra Divakaruni, Jeffrey P. Gambino +1 more | 2003-04-15 |
| 6540938 | Liquid crystalline light-modulating device | Ali Afzali-Arkadani, Glenn Allen Held, Anthony Cyril Lowe, Robert D. Miller, Robert J. Twieg +1 more | 2003-04-01 |
| 6498061 | Negative ion implant mask formation for self-aligned, sublithographic resolution patterning for single-sided vertical device formation | Rama Divakaruni, Stephan Kudelka, Helmut Tews, Irene McStay, Kil-Ho Lee | 2002-12-24 |
| 6486024 | Integrated circuit trench device with a dielectric collar stack, and method of forming thereof | Helmut Tews, Alexander Michaelis, Stephan Kudelka, Ulrike Gruening | 2002-11-26 |