Issued Patents All Time
Showing 151–175 of 200 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8124953 | Sensor device having a porous structure element | Klaus Elian, Georg Meyer-Berg | 2012-02-28 |
| 8106654 | Magnetic sensor integrated circuit device and method | Helmut Wietschorke | 2012-01-31 |
| 8098476 | Fluidic electrostatic energy harvester | Markus Loehndorf, Terje Kvisteroey, Bjoern Blixhaven | 2012-01-17 |
| 8080993 | Sensor module with mold encapsulation for applying a bias magnetic field | Helmut Wietschorke | 2011-12-20 |
| 8017942 | Semiconductor device and method | Franco Mariani, Werner Kroeninger, Adolf Koller, Jens Arkenau | 2011-09-13 |
| 7952185 | Semiconductor device with hollow structure | Gottfried Beer | 2011-05-31 |
| 7944061 | Semiconductor device having through contacts through a plastic housing composition and method for the production thereof | Michael Bauer, Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Christian Stuempfl +1 more | 2011-05-17 |
| 7932599 | Semiconductor component of semiconductor chip size with flip-chip-like external contacts | Helmut Kiendl, Michael Weber | 2011-04-26 |
| 7872851 | Fluidic based variable capacitor for use in a fluidic electrostatic energy harvester | Markus Lohndorf, Terje Kvisteroey, Bjoern Blixhavn | 2011-01-18 |
| 7851925 | Wafer level packaged MEMS integrated circuit | Markus Loehndorf, Florian Schoen | 2010-12-14 |
| 7851829 | Semiconductor chip module | — | 2010-12-14 |
| 7847387 | Electrical device and method | Thomas Kilger | 2010-12-07 |
| 7838989 | Semiconductor component and apparatus for production of a semiconductor component | Jochen Dangelmaier, Mario Engl | 2010-11-23 |
| 7836764 | Electrical device with covering | Albert Auburger, Terje Skog, Jean Schmitt | 2010-11-23 |
| 7830022 | Semiconductor package | Adolf Koller | 2010-11-09 |
| 7814781 | Active and adaptive tire systems | Jakob Jongsma | 2010-10-19 |
| 7807506 | Microelectromechanical semiconductor component with cavity structure and method for producing the same | Gottfried Beer | 2010-10-05 |
| 7799659 | Singulating semiconductor wafers to form semiconductor chips | Klaus Pressel, Adolf Koller | 2010-09-21 |
| 7786577 | Component with chip through-contacts | Jochen Dangelmaier | 2010-08-31 |
| 7781876 | Curing layers of a semiconductor product using electromagnetic fields | Manfred Mengel, Joachim Mahler | 2010-08-24 |
| 7775115 | Sensor component and method for producing a sensor component | Thomas Herndl, Werner Weber, Joachim Weitzel, Albert Auburger | 2010-08-17 |
| 7772693 | Panel, semiconductor device and method for the production thereof | Adolf Koller, Ralf Otremba, Josef Hoeglauer, Helmut Strack, Reinhard Ploss | 2010-08-10 |
| 7759135 | Method of forming a sensor node module | — | 2010-07-20 |
| 7745916 | Module comprising polymer-containing electrical connecting element | — | 2010-06-29 |
| 7732915 | Semiconductor sensor device with sensor chip and method for producing the same | Jochen Dangelmaier | 2010-06-08 |