Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5777815 | Disk drive with shock detection based on thermoresistive signal from magnetoresistive head | Prakash Kasiraj, Steven W. Meeks | 1998-07-07 |
| 5734519 | Contact magnetic recording disk file with improved head assembly | Robert E. Fontana, Jr., Cherngye Hwang, Vlad Novotny, Celia E. Yeack-Scranton, Clinton David Snyder | 1998-03-31 |
| 5539267 | Microfabricated rotary motion wobble motor and disk drive incorporating it | Long-Sheng Fan, Robert E. Fontana, Jr., Archibald C. Munce, Jr., Hans Helmut Zappe | 1996-07-23 |
| 5374463 | Magnetic recording disk having a contiguous fullerene film and a protective overcoat | Donald S. Bethune, Mattanjah Sjim'on de Vries, Gerard Meijer, Vlad Novotny, Anthony W. Wu | 1994-12-20 |
| 5242569 | Thermocompression bonding in integrated circuit packaging | Sung Kwon Kang, Michael J. Palmer, Robert D. Topa | 1993-09-07 |
| 5189363 | Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester | Mark F. Bregman, Paul R. Hoffman, Peter G. Ledermann, Paul A. Moskowitz, Roger A. Pollak +1 more | 1993-02-23 |
| 5184183 | Apparatus for printing grey scale images | John P. Karidis, Lawrence B. Schein | 1993-02-02 |
| 5148261 | Thermocompression bonding in integrated circuit packaging | Sung Kwon Kang, Michael J. Palmer, Robert D. Topa | 1992-09-15 |
| 5142337 | Printing grey scale images | John P. Karidis, Lawrence B. Schein | 1992-08-25 |
| 5135155 | Thermocompression bonding in integrated circuit packaging | Sung Kwon Kang, Michael J. Palmer, Robert D. Topa | 1992-08-04 |
| 5134460 | Aluminum bump, reworkable bump, and titanium nitride structure for tab bonding | Michael John Brady, Sung Kwon Kang, Paul A. Moskowitz, James G. Ryan, Erick G. Walton +2 more | 1992-07-28 |
| 5120418 | Lead frame plating apparatus for thermocompression bonding | Sung Kwon Kang, Michael J. Palmer, Robert D. Topa | 1992-06-09 |
| 5028983 | Multilevel integrated circuit packaging structures | Harry R. Bickford, Mark F. Bregman, Thomas M. Cipolla, John Gow, 3rd, Peter G. Ledermann +5 more | 1991-07-02 |
| 5006917 | Thermocompression bonding in integrated circuit packaging | Sung Kwon Kang, Michael J. Palmer, Robert D. Topa | 1991-04-09 |
| 4956605 | Tab mounted chip burn-in apparatus | Harry R. Bickford, William L. Boland, Daniel Peter Morris | 1990-09-11 |
| 4862322 | Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween | Harry R. Bickford, Mark F. Bregman, Paul A. Moskowitz, Michael J. Palmer, Paige A. Poore +1 more | 1989-08-29 |
| 4814855 | Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape | Rodney T. Hodgson, Harry J. Jones, Peter G. Ledermann, Paul A. Moskowitz | 1989-03-21 |
| 4555285 | Forming patterns in metallic or ceramic substrates | Dudley A. Chance, Michael Sampogna | 1985-11-26 |
| 4430690 | Low inductance MLC capacitor with metal impregnation and solder bar contact | Dudley A. Chance, Chung W. Ho | 1984-02-07 |