Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7516879 | Method of producing coaxial solder bump connections using injection molding of solder | Stephen L. Buchwalter, Peter A. Gruber | 2009-04-14 |
| 7506794 | High-temperature alloy standoffs for injection molding of solder | Peter A. Gruber | 2009-03-24 |
| 7497366 | Global vacuum injection molded solder system and method | S. Jay Chey, Peter A. Gruber, John U. Knickerbocker, James L. Speidell | 2009-03-03 |
| 7456640 | Structure for coupling probes of probe device to corresponding electrical contacts on product substrate | Ronald Richard Breton, S. Jay Chey, Matthew J. Farinelli, Michael David Fregeau, Sherif A. Goma +2 more | 2008-11-25 |
| 7416104 | Rotational fill techniques for injection molding of solder | Peter A. Gruber, John U. Knickerbocker, James L. Speidell | 2008-08-26 |
| 7410090 | Conductive bonding material fill techniques | Peter A. Gruber, John U. Knickerbocker, James L. Speidell | 2008-08-12 |
| 7410092 | Fill head for injection molding of solder | Peter A. Gruber, John U. Knickerbocker, James L. Speidell | 2008-08-12 |
| 7385457 | Flexible capacitive coupler assembly and method of manufacture | Matthew J. Farinelli, Robert B. Garner, Winfried W. Wilcke | 2008-06-10 |
| 7029830 | Precision and apertures for lithographic systems | Michael James Cordes, James L. Speidell, Scott M. Mansfield | 2006-04-18 |
| 6893902 | Method and apparatus for thermal management of integrated circuits | Michael James Cordes, Uttam Shyamalindu Ghoshal, Errol Wayne Robinson, James L. Speidell | 2005-05-17 |
| 6866415 | Scanning heat flow probe | David R. DiMilia, James P. Doyle, Matthew J. Farinelli, Snigdha Ghoshal, Uttam Shyamalindu Ghoshal +2 more | 2005-03-15 |
| 6832747 | Hybrid molds for molten solder screening process | David Danovitch, Peter A. Gruber, James L. Speidell, Joseph Zinter | 2004-12-21 |
| 6817761 | Scanning heat flow probe | David R. DiMilia, James P. Doyle, Matthew J. Farinelli, Snigdha Ghoshal, Uttam Shyamalindu Ghoshal +2 more | 2004-11-16 |
| 6798953 | Guides lithographically fabricated on semiconductor devices | Mitchell S. Cohen, Michael James Cordes, William K. Hogan, Glen Walden Johnson, Daniel M. Kuchta +4 more | 2004-09-28 |
| 6713827 | Micro-structures and methods for their manufacture | Guy M. Cohen, Joanna Rosner, Jeannine M. Trewhella | 2004-03-30 |
| 6679625 | Scanning heat flow probe | David R. DiMilia, James P. Doyle, Matthew J. Farinelli, Snigdha Ghoshal, Uttam Shyamalindu Ghoshal +2 more | 2004-01-20 |
| 6652139 | Scanning heat flow probe and the method of fabricating the same | David R. DiMilia, James P. Doyle, Matthew J. Farinelli, Snigdha Ghoshal, Uttam Shyamalindu Ghoshal +2 more | 2003-11-25 |
| 6613602 | Method and system for forming a thermoelement for a thermoelectric cooler | Emanuel I. Cooper, David R. DiMilia, Bruce B. Doris, James P. Doyle, Uttam Shyamalindu Ghoshal +1 more | 2003-09-02 |
| 6614109 | Method and apparatus for thermal management of integrated circuits | Michael James Cordes, Uttam Shyamalindu Ghoshal, Errol Wayne Robinson, James L. Speidell | 2003-09-02 |
| 6562642 | Micro-structures and methods for their manufacture | Guy M. Cohen, Joanna Rosner, Jeannine M. Trewhella | 2003-05-13 |
| 6426241 | Method for forming three-dimensional circuitization and circuits formed | Peter A. Gruber, James L. Speidell, Wayne J. Howell, Thomas G. Ference | 2002-07-30 |
| 6390439 | Hybrid molds for molten solder screening process | David Danovitch, Peter A. Gruber, James L. Speidell, Joseph Zinter | 2002-05-21 |
| 6384312 | Thermoelectric coolers with enhanced structured interfaces | Uttam Shyamalindu Ghoshal, David R. DiMilia, James P. Doyle, James L. Speidell | 2002-05-07 |
| 6350625 | Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereof | Mitchell S. Cohen, William K. Hogan, Sudipta K. Ray, James L. Speidell, S. Jay Chey | 2002-02-26 |
| 6332569 | Etched glass solder bump transfer for flip chip integrated circuit devices | Peter A. Gruber, Egon Max Kummer, Stephen Roux, Carlos J. Sambucetti, James L. Speidell | 2001-12-25 |