Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12292472 | Testing a single chip in a wafer probing system | Thomas Gentner, Alejandro Alberto Cook Lobo | 2025-05-06 |
| 11808808 | Testing a single chip in a wafer probing system | Thomas Gentner, Alejandro Alberto Cook Lobo | 2023-11-07 |
| 11574695 | Logic built-in self-test of an electronic circuit | Alejandro Alberto Cook Lobo, Thomas Gentner, Michael Kugel | 2023-02-07 |
| 11262381 | Device for positioning a semiconductor die in a wafer prober | Jörg Georg Appinger, Martin Eckert, Quintino L. Trianni | 2022-03-01 |
| 11239152 | Integrated circuit with optical tunnel | Thomas Gentner, Martin Eckert | 2022-02-01 |
| 11209479 | Stressing integrated circuits using a radiation source | Martin Eckert, Matthias Pflanz, Juergen Pille | 2021-12-28 |
| 10288684 | On-chip hardware-controlled window strobing | Thomas Gentner, Daniel Rodko, Hagen Schmidt | 2019-05-14 |
| 10281527 | On-chip hardware-controlled window strobing | Thomas Gentner, Daniel Rodko, Hagen Schmidt | 2019-05-07 |
| 10114069 | Method for electrical testing of a 3-D chip stack | Martin Eckert, Eckhard Kunigkeit, Quintino L. Trianni | 2018-10-30 |
| 10114914 | Layout effect characterization for integrated circuits | Martin Eckert, Thomas Gentner, Jens Kuenzer, Antje Mueller, Thomas Strach | 2018-10-30 |
| 10056346 | Chip attach frame | Martin Eckert, Quintino L. Trianni | 2018-08-21 |
| 9977053 | Wafer probe alignment | Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera +2 more | 2018-05-22 |
| 9927463 | Wafer probe alignment | Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera +2 more | 2018-03-27 |
| 9904748 | Layout effect characterization for integrated circuits | Martin Eckert, Thomas Gentner, Jens Kuenzer, Antje Mueller, Thomas Strach | 2018-02-27 |
| 9740813 | Layout effect characterization for integrated circuits | Martin Eckert, Thomas Gentner, Jens Kuenzer, Antje Mueller, Thomas Strach | 2017-08-22 |
| 9709625 | Measuring power consumption in an integrated circuit | Martin Eckert, Roland Frech, Claudio Siviero, Jochen Supper, Thomas-Michael Winkel | 2017-07-18 |
| 9686895 | Chip attach frame | Martin Eckert, Quintino L. Trianni | 2017-06-20 |
| 9679665 | Method for performing built-in self-tests | Martin Eckert, Christian Zoellin | 2017-06-13 |
| 9627017 | RAM at speed flexible timing and setup control | Martin Eckert, Michael Kugel, Tobias Werner | 2017-04-18 |
| 9627090 | RAM at speed flexible timing and setup control | Martin Eckert, Michael Kugel, Tobias Werner | 2017-04-18 |
| 9620244 | Determining categories for memory fail conditions | Martin Eckert, Nils Schlemminger | 2017-04-11 |
| 9496188 | Soldering three dimensional integrated circuits | Martin Eckert, Eckhard Kunigkeit, Quintino L. Trianni | 2016-11-15 |
| 9401222 | Determining categories for memory fail conditions | Martin Eckert, Nils Schlemminger | 2016-07-26 |
| 9322848 | Ball grid array configuration for reliable testing | Dieter Wendel | 2016-04-26 |
| 9250289 | System for electrical testing and manufacturing of a 3-D chip stack and method | Martin Eckert, Eckhard Kunigkeit, Quintino L. Trianni | 2016-02-02 |