| 10461715 |
Mitigating power noise using a current supply |
Martin Bernhard Schmidt, Thomas Strach, Hubert Harrer |
2019-10-29 |
| 9709625 |
Measuring power consumption in an integrated circuit |
Martin Eckert, Roland Frech, Claudio Siviero, Otto A. Torreiter, Thomas-Michael Winkel |
2017-07-18 |
| 9337122 |
Transferring heat through an optical layer of integrated circuitry |
Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more |
2016-05-10 |
| 9094306 |
Network power fault detection |
Martin Eckert, Roland Frech, Claudio Siviero, Otto A. Torreiter, Thomas-Michael Winkel |
2015-07-28 |
| 9064080 |
Transferring heat through an optical layer of integrated circuitry |
Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more |
2015-06-23 |
| 9058461 |
Transferring heat through an optical layer of integrated circuitry |
Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more |
2015-06-16 |
| 8989532 |
Integrated circuit package connected to an optical data transmission medium using a coolant |
Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more |
2015-03-24 |
| 8805132 |
Integrated circuit package connected to a data transmission medium |
Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more |
2014-08-12 |
| 8659310 |
Method and system for performing self-tests in an electronic system |
Martin Eckert, Roland Frech, Otto A. Torreiter |
2014-02-25 |
| 8519720 |
Method and system for impedance measurement in an integrated Circuit |
Roland Frech, Thomas-Michael Winkel |
2013-08-27 |
| 8476112 |
Optimized semiconductor packaging in a three-dimensional stack |
Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel +2 more |
2013-07-02 |
| 8427833 |
Thermal power plane for integrated circuits |
Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel +2 more |
2013-04-23 |
| 8405998 |
Heat sink integrated power delivery and distribution for integrated circuits |
Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel +2 more |
2013-03-26 |
| 8253234 |
Optimized semiconductor packaging in a three-dimensional stack |
Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel +2 more |
2012-08-28 |
| 7302664 |
System and method for automatic insertion of on-chip decoupling capacitors |
Anand Haridass, Andreas Huber, Erich Klink |
2007-11-27 |
| 7266788 |
Via/BSM pattern optimization to reduce DC gradients and pin current density on single and multi-chip modules |
Anand Haridass, Andreas Huber, Erich Klink, Thomas Strach |
2007-09-04 |
| 6665843 |
Method and system for quantifying the integrity of an on-chip power supply network |
Roland Frech, Andreas Huber, Erich Klink |
2003-12-16 |
| 6535075 |
Tunable on-chip capacity |
Roland Frech, Erich Klink |
2003-03-18 |
| 6424058 |
Testable on-chip capacity |
Roland Frech, Erich Klink |
2002-07-23 |
