Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461715 | Mitigating power noise using a current supply | Martin Bernhard Schmidt, Thomas Strach, Hubert Harrer | 2019-10-29 |
| 9709625 | Measuring power consumption in an integrated circuit | Martin Eckert, Roland Frech, Claudio Siviero, Otto A. Torreiter, Thomas-Michael Winkel | 2017-07-18 |
| 9337122 | Transferring heat through an optical layer of integrated circuitry | Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more | 2016-05-10 |
| 9094306 | Network power fault detection | Martin Eckert, Roland Frech, Claudio Siviero, Otto A. Torreiter, Thomas-Michael Winkel | 2015-07-28 |
| 9064080 | Transferring heat through an optical layer of integrated circuitry | Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more | 2015-06-23 |
| 9058461 | Transferring heat through an optical layer of integrated circuitry | Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more | 2015-06-16 |
| 8989532 | Integrated circuit package connected to an optical data transmission medium using a coolant | Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more | 2015-03-24 |
| 8805132 | Integrated circuit package connected to a data transmission medium | Harry Barowski, Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber +5 more | 2014-08-12 |
| 8659310 | Method and system for performing self-tests in an electronic system | Martin Eckert, Roland Frech, Otto A. Torreiter | 2014-02-25 |
| 8519720 | Method and system for impedance measurement in an integrated Circuit | Roland Frech, Thomas-Michael Winkel | 2013-08-27 |
| 8476112 | Optimized semiconductor packaging in a three-dimensional stack | Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel +2 more | 2013-07-02 |
| 8427833 | Thermal power plane for integrated circuits | Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel +2 more | 2013-04-23 |
| 8405998 | Heat sink integrated power delivery and distribution for integrated circuits | Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel +2 more | 2013-03-26 |
| 8253234 | Optimized semiconductor packaging in a three-dimensional stack | Harry Barowski, Thomas J. Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel +2 more | 2012-08-28 |
| 7302664 | System and method for automatic insertion of on-chip decoupling capacitors | Anand Haridass, Andreas Huber, Erich Klink | 2007-11-27 |
| 7266788 | Via/BSM pattern optimization to reduce DC gradients and pin current density on single and multi-chip modules | Anand Haridass, Andreas Huber, Erich Klink, Thomas Strach | 2007-09-04 |
| 6665843 | Method and system for quantifying the integrity of an on-chip power supply network | Roland Frech, Andreas Huber, Erich Klink | 2003-12-16 |
| 6535075 | Tunable on-chip capacity | Roland Frech, Erich Klink | 2003-03-18 |
| 6424058 | Testable on-chip capacity | Roland Frech, Erich Klink | 2002-07-23 |