Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8383505 | Solder ball contact susceptible to lower stress | Luc Guerin, Mario J. Interrante, Thuy L. Tran-Quinn, Van Thanh Truong | 2013-02-26 |
| 8379847 | Data and control encryption | Robert H. Bell, Jr., Louis Bennie Capps, Jr. | 2013-02-19 |
| 8327126 | Multicore processor and method of use that adapts core functions based on workload execution | Robert H. Bell, Jr., Louis Bennie Capps, Jr., Thomas E. Cook, Glenn G. Daves, Ronald E. Newhart +1 more | 2012-12-04 |
| 8312455 | Optimizing execution of single-threaded programs on a multiprocessor managed by compilation | Robert H. Bell, Jr., Louis Bennie Capps, Jr., Michael A. Paolini | 2012-11-13 |
| 8299584 | Alignment of wafers for 3D integration | Dmitriy Shneyder, Srinivasan Rangarajan, Anthony K. Stamper, Huilong Zhu | 2012-10-30 |
| 8232648 | Semiconductor article having a through silicon via and guard ring | Vincent J. McGahay | 2012-07-31 |
| 8214660 | Structure for an apparatus for monitoring and controlling heat generation in a multi-core processor | Louis Bennie Capps, Jr., Warren D. Dyckman | 2012-07-03 |
| 7999377 | Method and structure for optimizing yield of 3-D chip manufacture | Edward M. DeMulder, Sarah H. Knickerbocker, Albert M. Young | 2011-08-16 |
| 7996346 | Method for autonomic workload distribution on a multicore processor | Robert H. Bell, Jr., Louis Bennie Capps, Jr., Thomas E. Cook, Thomas J. Dewkett, Naresh Nayar +2 more | 2011-08-09 |
| 7996693 | Integrated circuit environment initialization according to information stored within the integrated circuit | Louis Bennie Capps, Jr., Mark Elliott Hack, Steven Paul Hartman | 2011-08-09 |
| 7962770 | Dynamic processor reconfiguration for low power without reducing performance based on workload execution characteristics | Louis Bennie Capps, Jr., Robert H. Bell, Jr. | 2011-06-14 |
| 7930129 | Uniform power density across processor cores at burn-in | Louis Bennie Capps, Jr., Anand Haridass, Ronald E. Newhart | 2011-04-19 |
| 7870337 | Power-aware line intervention for a multiprocessor snoop coherency protocol | Robert H. Bell, Jr., Louis Bennie Capps, Jr., Thomas E. Cook, Naresh Nayar | 2011-01-11 |
| 7737003 | Method and structure for optimizing yield of 3-D chip manufacture | Edward M. DeMulder, Sarah H. Knickerbocker, Albert M. Young | 2010-06-15 |
| 7721119 | System and method to optimize multi-core microprocessor performance using voltage offsets | Louis Bennie Capps, Jr., Warren D. Dyckman, Joanne Ferris, Anand Haridass, James D. Jordan +2 more | 2010-05-18 |
| 7667470 | Power grid structure to optimize performance of a multiple core processor | Jean Audet, Louis Bennie Capps, Jr., Glenn G. Daves, Anand Haridass, Ronald E. Newhart | 2010-02-23 |
| 7617403 | Method and apparatus for controlling heat generation in a multi-core processor | Louis Bennie Capps, Jr., Warren D. Dyckman | 2009-11-10 |
| 7584369 | Method and apparatus for monitoring and controlling heat generation in a multi-core processor | Louis Bennie Capps, Jr., Warren D. Dyckman | 2009-09-01 |
| 7472297 | Method initializing an environment of an integrated circuit according to information stored within the integrated circuit | Louis Bennie Capps, Jr., Mark Elliott Hack, Steven Paul Hartman | 2008-12-30 |
| 7420378 | Power grid structure to optimize performance of a multiple core processor | Jean Audet, Louis Bennie Capps, Jr., Glenn G. Daves, Anand Haridass, Ronald E. Newhart | 2008-09-02 |
| 7389195 | Uniform power density across processor cores at burn-in | Louis Bennie Capps, Jr., Anand Haridass, Ronald E. Newhart | 2008-06-17 |
| 7268570 | Apparatus and method for customized burn-in of cores on a multicore microprocessor integrated circuit chip | Jean Audet, Louis Bennie Capps, Jr., Glenn G. Daves, Joanne Ferris, Anand Haridass +1 more | 2007-09-11 |
| 6573538 | Semiconductor device with internal heat dissipation | William T. Motsiff | 2003-06-03 |
| 6268660 | Silicon packaging with through wafer interconnects | Sang Hoo Dhong, Harm Peter Hofstee | 2001-07-31 |
| 6221769 | Method for integrated circuit power and electrical connections via through-wafer interconnects | Sang Hoo Dhong, Kevin John Nowka | 2001-04-24 |