JH

James N. Humenik

IBM: 36 patents #2,696 of 70,183Top 4%
AV Avx: 1 patents #146 of 248Top 60%
LP Lenovo (Singapore) Pte.: 1 patents #471 of 1,012Top 50%
📍 Lagrangeville, NY: #18 of 200 inventorsTop 9%
🗺 New York: #2,966 of 115,490 inventorsTop 3%
Overall (All Time): #90,646 of 4,157,543Top 3%
37
Patents All Time

Issued Patents All Time

Showing 26–37 of 37 patents

Patent #TitleCo-InventorsDate
5857883 Method of forming perforated metal/ferrite laminated magnet John U. Knickerbocker, Andrew Ramsay Knox, Robert Rosenberg 1999-01-12
5480503 Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof Jon A. Casey, David B. Goland, Dinesh Gupta, Lester W. Herron, Thomas E. Lombardi +3 more 1996-01-02
5277725 Process for fabricating a low dielectric composite substrate John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more 1994-01-11
5139851 Low dielectric composite substrate John Acocella, Arnold I. Baise, Richard A. Bates, Jon A. Casey, David R. Clarke +10 more 1992-08-18
5139852 Low dielectric composite substrate Arnold I. Baise, Ray M. Bryant, Jon A. Casey, Allen J. Dam, Werner E. Dunkel +4 more 1992-08-18
5135595 Process for fabricating a low dielectric composite substrate John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more 1992-08-04
4937930 Method for forming a defect-free surface on a porous ceramic substrate Ekkehard F. Miersch, Charles H. Perry, Janusz S. Wilczynski 1990-07-03
4862318 Method of forming thin film terminations of low inductance ceramic capacitors and resultant article John L. Galvagni, James M. Oberschmidt 1989-08-29
4755631 Apparatus for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate Robert W. Churchwell, Philip L. Flaitz 1988-07-05
4672739 Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate Robert W. Churchwell, Philip L. Flaitz 1987-06-16
4439813 Thin film discrete decoupling capacitor William E. Dougherty, Jr., Irving Feinberg, Alan Platt 1984-03-27
4251820 Solder glass bonded charge electrode assembly for ink jet printers 1981-02-17