Issued Patents All Time
Showing 101–125 of 129 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709544 | Chemical mechanical polishing equipment | Shao-Chung Hu, Chia-Lin Hsu, Shih-Hsun Hsu | 2004-03-23 |
| 6660627 | Method for planarization of wafers with high selectivities | Shao-Chung Hu, Shih-Hsun Hsu, Chia-Lin Hsu | 2003-12-09 |
| 6638391 | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same | Chia-Lin Hsu, Art Yu, Shih-Hsun Hsu | 2003-10-28 |
| 6583489 | Method for forming interconnect structure with low dielectric constant | Sung-Hsiung Wang, Yi-Min Huang, Gwo-Shii Yang, Chiung-Sheng Hsiung, Chih-Chien Liu | 2003-06-24 |
| 6580508 | Method for monitoring a semiconductor wafer in a chemical mechanical polishing process | Chien-Hung Chen, Juan-Yuan Wu | 2003-06-17 |
| 6559004 | Method for forming three dimensional semiconductor structure and three dimensional capacitor | Gwo-Shii Yang, Chiung-Sheng Hsiung, Tong-Yu Chen, Sung-Hsiung Wang | 2003-05-06 |
| 6544373 | Polishing pad for a chemical mechanical polishing process | Teng-Chun Tsai | 2003-04-08 |
| 6524962 | Method for forming dual-damascene interconnect structure | Teng-Chun Tsai, Yi-Min Huang | 2003-02-25 |
| 6461230 | Chemical-mechanical polishing method | Teng-Chun Tsai, Ming-Sheng Yang | 2002-10-08 |
| 6403469 | Method of manufacturing dual damascene structure | Teng-Chun Tsai, Ming-Sheng Yang | 2002-06-11 |
| 6380069 | Method of removing micro-scratch on metal layer | Yung-Tsung Wei, Ming-Sheng Yang | 2002-04-30 |
| 6344408 | Method for improving non-uniformity of chemical mechanical polishing by over coating | Ming-Sheng Yang, Juan-Yuan Wu, Water Lur | 2002-02-05 |
| 6309555 | Method for determining thickness of material layer and chemical mechanical polishing endpoint | — | 2001-10-30 |
| 6303461 | Method for fabricating a shallow trench isolation structure | Chien-Hung Chen | 2001-10-16 |
| 6238997 | Method of fabricating shallow trench isolation | Chien-Hung Chen | 2001-05-29 |
| 6239017 | Dual damascene CMP process with BPSG reflowed contact hole | Chine-Gie Lou | 2001-05-29 |
| 6210256 | Continuous pad feeding method for chemical-mechanical polishing | Wen-Cheng Yeh, Ming-Sheng Yang | 2001-04-03 |
| 6184130 | Silicide glue layer for W-CVD plug application | Tzu-Kun Ku, Chine-Gie Lou | 2001-02-06 |
| 6155912 | Cleaning solution for cleaning a polishing pad used in a chemical-mechanical polishing process | Ming-Sheng Yang, Juan-Yuan Wu | 2000-12-05 |
| 6139680 | Exhaust line of chemical-mechanical polisher | Chien-Hung Chen | 2000-10-31 |
| 6110826 | Dual damascene process using selective W CVD | Chine-Gie Lou | 2000-08-29 |
| 6099705 | Physical vapor deposition device for forming a uniform metal layer on a semiconductor wafer | Juan-Yuan Wu, Water Lur | 2000-08-08 |
| 6093089 | Apparatus for controlling uniformity of polished material | Juan-Yuan Wu, Water Lur | 2000-07-25 |
| 6077147 | Chemical-mechanical polishing station with end-point monitoring device | Ming-Sheng Yang, Tsang-Jung Lin, Juan-Yuan Wu | 2000-06-20 |
| 6062964 | Chemical mechanical polishing apparatus for controlling slurry distribution | Ming-Sheng Yang, Juan-Yuan Wu | 2000-05-16 |