Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10913070 | Microarray carrier assembly | Wei Zhou, Lin-Hsin Tu, Yao-Kuang Chung, Glenn McGall | 2021-02-09 |
| 10872924 | Microarray and method for forming the same | Yao-Kuang Chung, Chun-Hao Chang | 2020-12-22 |
| 10732166 | Method for in-line measurement of quality of microarray | Yao-Kuang Chung, Yu-Chen Wang, Po-Yen Liu | 2020-08-04 |
| 10416114 | Structures and manufacture method of electrochemical units | Jui-Chin Chen, Pei-Jer Tzeng, Yu-Chen Hsin, Yiu-Hsiang Chang | 2019-09-17 |
| 9368475 | Semiconductor device and manufacturing method thereof | Shang-Chun Chen, Cha-Hsin Lin | 2016-06-14 |
| 9257338 | TSV substrate structure and the stacked assembly thereof | Chung-Chih Wang, Pei-Jer Tzeng, Cha-Hsin Lin | 2016-02-09 |
| 9257322 | Method for manufacturing through substrate via (TSV), structure and control method of TSV capacitance | Erh-Hao Chen, Cha-Hsin Lin | 2016-02-09 |
| 9093312 | Semiconductor device and manufacturing method thereof | Shang-Chun Chen, Cha-Hsin Lin | 2015-07-28 |
| 8445995 | Semiconductor structure with conductive plug in an oxide layer | Cha-Hsin Lin | 2013-05-21 |
| 8309402 | Method of fabricating oxide material layer with openings attached to device layers | Cha-Hsin Lin | 2012-11-13 |
| 6784075 | Method of forming shallow trench isolation with silicon oxynitride barrier film | Chian-Kai Huang | 2004-08-31 |
| 6743690 | Method of forming a metal-oxide semiconductor transistor | Wen-Chu Huang | 2004-06-01 |
| 6720235 | Method of forming shallow trench isolation in a semiconductor substrate | Chian-Kai Huang | 2004-04-13 |
| 6713379 | Method for forming a damascene structure | Chia-Yang Wu | 2004-03-30 |
| 6258716 | CVD titanium silicide for contact hole plugs | — | 2001-07-10 |
| 6184130 | Silicide glue layer for W-CVD plug application | Hsueh-Chung Chen, Chine-Gie Lou | 2001-02-06 |
| 6184135 | Insitu formation of TiSi2/TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi2 layer | — | 2001-02-06 |
| 6071552 | Insitu formation of TiSi.sub.2 /TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi.sub.2 layer | — | 2000-06-06 |
| 5930671 | CVD titanium silicide for contract hole plugs | — | 1999-07-27 |
| 5856237 | Insitu formation of TiSi2/TiN bi-layer structures using self-aligned nitridation treatment on underlying CVD-TiSi2 layer | — | 1999-01-05 |
| 5643032 | Method of fabricating a field emission device | Huang-Chung Cheng | 1997-07-01 |