Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12200875 | Copper metallization for through-glass vias on thin glass | Jen-Chieh Lin, Prantik Mazumder, Scott Christopher Pollard, Pei-Lien Tseng | 2025-01-14 |
| 10416114 | Structures and manufacture method of electrochemical units | Jui-Chin Chen, Pei-Jer Tzeng, Tzu-Kun Ku, Yu-Chen Hsin | 2019-09-17 |