Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7703053 | Regional pattern density determination method and system | Geoffrey Kendall Abbott, David P. Parker | 2010-04-20 |
| 7689961 | Increased power line noise immunity in IC using capacitor structure in fill area | Florian Braun, Hanyi Ding, Kai D. Feng, Zhong-Xiang He, Xuefeng Liu +1 more | 2010-03-30 |
| 7573130 | Crack trapping and arrest in thin film structures | Thomas M. Shaw, Michael Lane, Xio Hu Liu, Griselda Bonilla, James P. Doyle +1 more | 2009-08-11 |
| 7537941 | Variable overlap of dummy shapes for improved rapid thermal anneal uniformity | Brent A. Anderson, Edward J. Nowak | 2009-05-26 |
| 7498250 | Shapes-based migration of aluminum designs to copper damascene | Timothy G. Dunham, Ezra D. B. Hall, Mark A. Lavin, William C. Leipold | 2009-03-03 |
| 7491578 | Method of forming crack trapping and arrest in thin film structures | Thomas M. Shaw, Michael Lane, Xio Hu Liu, Griselda Bonilla, James P. Doyle +1 more | 2009-02-17 |
| 7479701 | Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics | — | 2009-01-20 |
| 7312141 | Shapes-based migration of aluminum designs to copper damascene | Timothy G. Dunham, Ezra D. B. Hall, Mark A. Lavin, William C. Leipold | 2007-12-25 |
| 7269818 | Circuit element function matching despite auto-generated dummy shapes | — | 2007-09-11 |
| 7250363 | Aligned dummy metal fill and hole shapes | Jeanne-Tania Sucharitaves | 2007-07-31 |
| 7015582 | Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics | — | 2006-03-21 |
| 6992002 | Shapes-based migration of aluminum designs to copper damascence | Timothy G. Dunham, Ezra D. B. Hall, Mark A. Lavin, William C. Leipold | 2006-01-31 |
| 6743710 | Stacked fill structures for support of dielectric layers | Timothy G. Dunham, William T. Motsiff | 2004-06-01 |
| 6559543 | Stacked fill structures for support of dielectric layers | Timothy G. Dunham, William T. Motsiff | 2003-05-06 |
| 6528883 | Shapes-based migration of aluminum designs to copper damascene | Timothy G. Dunham, Ezra D. B. Hall, Mark A. Lavin, William C. Leipold | 2003-03-04 |
| 6495917 | Method and structure of column interconnect | John J. Ellis-Monaghan, Paul M. Feeney, Robert M. Geffken, Rosemary A. Previti-Kelly, Bette L. Bergman Reuter +3 more | 2002-12-17 |
| 6444581 | AB etch endpoint by ABFILL compensation | Paul C. Buschner, Timothy G. Dunham | 2002-09-03 |
| 6399976 | Shrink-wrap collar for DRAM deep trenches | Peter J. Geiss, Son V. Nguyen | 2002-06-04 |
| 6270353 | Low cost shallow trench isolation using non-conformal dielectric material | John Andrews, Bao-Tai Hwang, Shaw-Ning Mei, James M. Tyler, Edward J. Vishnesky | 2001-08-07 |
| 6069049 | Shrink-wrap collar from DRAM deep trenches | Peter J. Geiss, Son V. Nguyen | 2000-05-30 |
| 5539240 | Planarized semiconductor structure with subminimum features | John Cronin | 1996-07-23 |
| 5466636 | Method of forming borderless contacts using a removable mandrel | John Cronin, Carter W. Kaanta, Donald M. Kenney, Michael L. Kerbaugh, Brian J. Machesney +3 more | 1995-11-14 |
| 5453639 | Planarized semiconductor structure using subminimum features | John Cronin | 1995-09-26 |
| 5292689 | Method for planarizing semiconductor structure using subminimum features | John Cronin | 1994-03-08 |
| 5036630 | Radial uniformity control of semiconductor wafer polishing | Carter W. Kaanta | 1991-08-06 |