Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6340601 | Method for reworking copper metallurgy in semiconductor devices | Thomas F. Curran, Timothy C. Krywanczyk, Michael S. Lube, Matthew D. Moon, Rock Nadeau +6 more | 2002-01-22 |
| 6294105 | Chemical mechanical polishing slurry and method for polishing metal/oxide layers | Paul M. Feeney, Timothy C. Krywanczyk, Lawrence D. David, Matthew T. Tiersch | 2001-09-25 |
| 6251775 | Self-aligned copper silicide formation for improved adhesion/electromigration | Douglas S. Armbrust, Margaret L. Gibson, Laura Serianni | 2001-06-26 |
| 6186873 | Wafer edge cleaning | Kent R. Becker, Stuart D. Cheney, Scott R. Cline, Paul A. Manfredi | 2001-02-13 |
| 6063687 | Formation of trench isolation for active areas and first level conductors | Edward W. Sengle, Mark D. Jaffe, Daniel N. Maynard, Mark A. Lavin, John A. Bracchitta | 2000-05-16 |
| 5734192 | Trench isolation for active areas and first level conductors | Edward W. Sengle, Mark D. Jaffe, Daniel N. Maynard, Mark A. Lavin, John A. Bracchitta | 1998-03-31 |
| 5666000 | Microcavity capacitive device | Michael S. Dusablon | 1997-09-09 |
| 5665655 | Process for producing crackstops on semiconductor devices and devices containing the crackstops | — | 1997-09-09 |
| 5576246 | Personalized area leadframe coining or half etching for reduced mechanical stress at device edge | Harold W. Conru, Francis E. Froebel, Albert J. Gregoritsch, Jr., Sheldon C. Rieley, Stephen G. Starr +2 more | 1996-11-19 |
| 5545921 | Personalized area leadframe coining or half etching for reduced mechanical stress at device edge | Harold W. Conru, Francis E. Froebel, Albert J. Gregoritsch, Jr., Sheldon C. Rieley, Stephen G. Starr +2 more | 1996-08-13 |
| 5530280 | Process for producing crackstops on semiconductor devices and devices containing the crackstops | — | 1996-06-25 |
| 5514832 | Microcavity structures, fabrication processes, and applications thereof | Michael S. Dusablon | 1996-05-07 |
| 5508234 | Microcavity structures, fabrication processes, and applications thereof | Michael S. Dusablon | 1996-04-16 |
| 5294570 | Reduction of foreign particulate matter on semiconductor wafers | Marshall J. Fleming, Jr., William A. Syverson | 1994-03-15 |