Issued Patents All Time
Showing 51–56 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6433436 | Dual-RIE structure for via/line interconnections | Christopher Adam Feild, Roy Iggulden, Rajiv V. Joshi | 2002-08-13 |
| 6420749 | Trench field shield in trench isolation | Ramachandra Divakaruni, Jeffrey P. Gambino, Jack A. Mandelman, Carl Radens, William R. Tonti | 2002-07-16 |
| 6383920 | Process of enclosing via for improved reliability in dual damascene interconnects | Ping-Chuan Wang, Ronald G. Filippi, Robert D. Edwards, Roy Iggulden | 2002-05-07 |
| 6380027 | Dual tox trench dram structures and process using V-groove | Toshiharu Furukawa, Jeffrey P. Gambino, Jack A. Mandelman, Carl Radens, William R. Tonti +1 more | 2002-04-30 |
| 6268638 | Metal wire fuse structure with cavity | Axel Brintzinger, Chandrasekhar Narayan, Carl Radens | 2001-07-31 |
| 5670018 | Isotropic silicon etch process that is highly selective to tungsten | Elke Eckstein, Birgit Hoffman, deceased, Waldemar Walter Kocon, Marc Jay Weiss | 1997-09-23 |