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Heat source integration for electromigration analysis |
Steven J. Baumgartner, James M. Johnson |
2017-07-18 |
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Bias-temperature induced damage mitigation circuit |
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2016-08-02 |
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Bias-temperature induced damage mitigation circuit |
David P. Paulsen, Kirk D. Peterson, John E. Sheets, II |
2016-07-26 |
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Calibrating on-chip resistors via a daisy chain scheme |
Benjamin A. Fox, Nathaniel J. Gibbs, Andrew Benson Maki, Trevor Joseph Timpane |
2013-05-28 |
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Field effect transistor having multiple conduction states |
Dureseti Chidambarrao, David R. Hanson |
2013-03-26 |
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Structure and method for forming a light detecting diode and a light emitting diode on a silicon-on-insulator wafer backside |
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2013-01-15 |
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CMOS diodes with dual gate conductors, and methods for forming the same |
Werner Rausch, Haining Yang |
2012-07-17 |
| 7768041 |
Multiple conduction state devices having differently stressed liners |
Dureseti Chidambarrao |
2010-08-03 |
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CMOS diodes with dual gate conductors, and methods for forming the same |
Werner Rausch, Haining Yang |
2010-06-15 |
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Silicon/silcion germaninum/silicon body device with embedded carbon dopant |
Anda C. Mocuta, Dureseti Chidambarrao, Ricardo A. Donaton, Kern Rim |
2009-07-14 |
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Methodology for layout-based modulation and optimization of nitride liner stress effect in compact models |
Dureseti Chidambarrao, Donald L. Jordan, Judith H. McCullen, Tina Wagner, Richard Q. Williams |
2008-02-26 |
| 7242239 |
Programming and determining state of electrical fuse using field effect transistor having multiple conduction states |
David R. Hanson, Dureseti Chidambarrao, Gregory J. Fredeman |
2007-07-10 |
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Sense amplifier including multiple conduction state field effect transistor |
David R. Hanson, Dureseti Chidambarrao |
2006-10-17 |
