TW

Thomas Werner

Globalfoundries: 31 patents #82 of 4,424Top 2%
AM AMD: 23 patents #450 of 9,279Top 5%
SA Schott Ag: 2 patents #437 of 1,181Top 40%
FI Finisar: 1 patents #409 of 719Top 60%
FE Friedrich-Alexander-Universität Erlangen-Nürnberg: 1 patents #91 of 311Top 30%
FG Fhr Anlagenbau Gmbh: 1 patents #2 of 19Top 15%
UE US Dept of Energy: 1 patents #1,355 of 5,099Top 30%
📍 Radebeul, IL: #1 of 1 inventorsTop 100%
Overall (All Time): #38,049 of 4,157,543Top 1%
61
Patents All Time

Issued Patents All Time

Showing 51–61 of 61 patents

Patent #TitleCo-InventorsDate
7462563 Method of forming an etch indicator layer for reducing etch non-uniformities Frank Feustel, Kai Frohberg 2008-12-09
7085300 Integral vertical cavity surface emitting laser and power monitor James K. Guenter 2006-08-01
7030044 Method of forming a cap layer having anti-reflective characteristics on top of a low-k dielectric Hartmut Ruelke, Joerg Hohage, Frank Mauersberger 2006-04-18
7022602 Nitrogen-enriched low-k barrier layer for a copper metallization layer Hartmut Ruelke, Joerg Hohage, Michael Kiene 2006-04-04
6964874 Void formation monitoring in a damascene process Peter Hübler, Frank Koschinsky 2005-11-15
6893956 Barrier layer for a copper metallization layer including a low-k dielectric Hartmut Ruelke, Joerg Hohage, Massud Aminpur 2005-05-17
6867610 Test structure for determining the stability of electronic devices comprising connected substrates Mathias Bottcher 2005-03-15
6724096 Die corner alignment structure Gunter Grasshoff, Bernd Schulz, Carsten Hartig 2004-04-20
6228758 Method of making dual damascene conductive interconnections and integrated circuit device comprising same John G. Pellerin 2001-05-08
5976948 Process for forming an isolation region with trench cap Robert Dawson 1999-11-02
4454495 Layered ultra-thin coherent structures used as electrical resistors having low temperature coefficient of resistivity Charles M. Falco, Ivan K. Schuller 1984-06-12