Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7022602 | Nitrogen-enriched low-k barrier layer for a copper metallization layer | Hartmut Ruelke, Joerg Hohage, Thomas Werner | 2006-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7022602 | Nitrogen-enriched low-k barrier layer for a copper metallization layer | Hartmut Ruelke, Joerg Hohage, Thomas Werner | 2006-04-04 |