Issued Patents All Time
Showing 76–100 of 767 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784268 | OTP elements with high aspect ratio MTJ | Chandrasekharan Kothandaraman, Babar A. Khan, Nathan P. Marchack | 2020-09-22 |
| 10777735 | Contact via structures | Chih-Chao Yang, Daniel C. Edelstein, Henry K. Utomo, Theodorus E. Standaert, Nathan P. Marchack | 2020-09-15 |
| 10777557 | Orientation engineering in complementary metal oxide semiconductor fin field effect transistor integration for increased mobility and sharper junction | Chia-Yu Chen, Hong He, Rajasekhar Venigalla | 2020-09-15 |
| 10770652 | Magnetic tunnel junction (MTJ) bilayer hard mask to prevent redeposition | Nathan P. Marchack, Pouya Hashemi | 2020-09-08 |
| 10763429 | Self-aligned ion beam etch sputter mask for magnetoresistive random access memory | Steve Holmes, Hyun Kyung Lee | 2020-09-01 |
| 10752932 | Biosensor for multi-analyte characterization | Hariklia Deligianni, Steven J. Holmes, Qinghuang Lin, Roy R. Yu | 2020-08-25 |
| 10734504 | Integration of strained silicon germanium PFET device and silicon NFET device for finFET structures | Hong He, Nicolas Loubet, Junli Wang | 2020-08-04 |
| 10734385 | Orientation engineering in complementary metal oxide semiconductor fin field effect transistor integration for increased mobility and sharper junction | Chia-Yu Chen, Hong He, Rajasekhar Venigalla | 2020-08-04 |
| 10727398 | MTJ containing device containing a bottom electrode embedded in diamond-like carbon | Nathan P. Marchack, Chandrasekharan Kothandaraman | 2020-07-28 |
| 10727316 | Vertical transistor fabrication and devices | Brent A. Anderson, Seong-Dong Kim, Rajasekhar Venigalla | 2020-07-28 |
| 10686124 | Contact via structures | Chih-Chao Yang, Daniel C. Edelstein, Henry K. Utomo, Theodorus E. Standaert, Nathan P. Marchack | 2020-06-16 |
| 10684246 | On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling | Hariklia Deligianni, Damon B. Farmer, Steven J. Holmes, Qinghuang Lin, Nathan P. Marchack +2 more | 2020-06-16 |
| 10658461 | Nanowire with sacrificial top wire | Josephine B. Chang, Michael A. Guillorn, Isaac Lauer, Xin Miao | 2020-05-19 |
| 10658391 | Hybrid substrate engineering in CMOS finFET integration for mobility improvement | Chia-Yu Chen, Hong He, Rajasekhar Venigalla | 2020-05-19 |
| 10639679 | Removing a residual photo-mask fence in photolithography | Hariklia Deligianni, Eugene J. O'Sullivan, Naigang Wang | 2020-05-05 |
| 10622459 | Vertical transistor fabrication and devices | Brent A. Anderson, Seong-Dong Kim, Rajasekhar Venigalla | 2020-04-14 |
| 10615278 | Preventing strained fin relaxation | Kangguo Cheng, Hong He, Sivananda K. Kanakasabapathy, Gauri Karve, Juntao Li +3 more | 2020-04-07 |
| 10607759 | Method of fabricating a laminated stack of magnetic inductor | Hariklia Deligianni, Eugene J. O'Sullivan, Naigang Wang | 2020-03-31 |
| 10597769 | Method of fabricating a magnetic stack arrangement of a laminated magnetic inductor | Hariklia Deligianni, Eugene J. O'Sullivan, Naigang Wang | 2020-03-24 |
| 10593450 | Magnetic inductor with multiple magnetic layer thicknesses | Hariklia Deligianni, Eugene J. O'Sullivan, Naigang Wang | 2020-03-17 |
| 10593449 | Magnetic inductor with multiple magnetic layer thicknesses | Hariklia Deligianni, Eugene J. O'Sullivan, Naigang Wang | 2020-03-17 |
| 10585060 | On-chip biosensors with nanometer scale glass-like carbon electrodes and improved adhesive coupling | Hariklia Deligianni, Damon B. Farmer, Steven J. Holmes, Qinghuang Lin, Nathan P. Marchack +2 more | 2020-03-10 |
| 10573444 | Stress control in magnetic inductor stacks | Hariklia Deligianni, Eugene J. O'Sullivan, Naigang Wang | 2020-02-25 |
| 10570504 | Structure and method to fabricate highly reactive physical vapor deposition target | Stephen L. Brown, Mark C. Reuter | 2020-02-25 |
| 10566493 | Device with integration of light-emitting diode, light sensor, and bio-electrode sensors on a substrate | Steve Holmes, Devendra K. Sadana, Stephen W. Bedell, Hariklia Deligianni, Jia Chen | 2020-02-18 |